Inventor · disambiguated record
Jinkyun Lee
Also filed as: LEE JINKYUN
6 granted patents·10 pending applications·8 citations·filing 2013–2024
71Inventor score
Files withUNIV INHA RES & BUSINESS FOUND8LG ELECTRONICS INC3LG DISPLAY CO LTD2LEE JINKYUN1SAMSUNG ELECTRONICS CO LTD1
Top patents by PatentIndex Score
16 records- 0178US9888982B2Device for generating data on clear alignerLEE JINKYUN·Filed 2015·Granted Feb 13, 2018·6 cites·12 claims
- 0275US9147842B2Photoresist employing photodimerization chemistry and method for manufacturing organic light emitting diode display using the sameLG DISPLAY CO LTD·Filed 2013·Granted Sep 29, 2015·2 cites·14 claims
- 0364US2025130491A1Resist composition for photolithography and method for manufacturing semiconductor devices using the sameUNIV INHA RES & BUSINESS FOUND·Filed 2024·Application pending·0 cites
- 0460US12360451B2Method of manufacturing semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jul 15, 2025·0 cites·20 claims
- 0560US2025034365A1Composite film and manufacturing method thereofLG ELECTRONICS INC·Filed 2022·Application pending·0 cites
- 0658US2025116923A1Resist composition for photolithography and method for manufacturing semiconductor devices using the sameUNIV INHA RES & BUSINESS FOUND·Filed 2024·Application pending·0 cites
- 0757US9666802B2Photoresist employing photodimerization chemistry and method for manufacturing organic light emitting diode display using the sameLG DISPLAY CO LTD·Filed 2015·Granted May 30, 2017·0 cites·8 claims
- 0855US2024295818A1Underlayer compound for photolithography, multilayered structure formed using the same, and method for manufacturing semiconductor devices using the sameUNIV INHA RES & BUSINESS FOUND·Filed 2024·Application pending·0 cites
- 0954US11939439B2Composite polyimide film, producing method thereof, and printed circuit board using sameLG ELECTRONICS INC·Filed 2021·Granted Mar 26, 2024·0 cites·17 claims
- 1054US2024255849A1Resist compound for photolithography, method for forming the same, and method for manufacturing semiconductor devices using the sameUNIV INHA RES & BUSINESS FOUND·Filed 2023·Application pending·0 cites
- 1153US2023375927A1Underlayer compound for photolithography, multilayered structure formed using the same, and method for manufacturing semiconductor devices using the sameUNIV INHA RES & BUSINESS FOUND·Filed 2023·Application pending·0 cites
- 1253US2023257580A1Polyimide and method of preparing the sameLG ELECTRONICS INC·Filed 2020·Application pending·0 cites
- 1352US2023375932A1Resist compound and underlayer compound for photolithography, multilayered structure formed using the same, and method for manufacturing semiconductor devices using the sameUNIV INHA RES & BUSINESS FOUND·Filed 2023·Application pending·0 cites
- 1450US2022137511A1Resist composition and method of forming pattern using the sameUNIV INHA RES & BUSINESS FOUND·Filed 2021·Application pending·0 cites
- 1548US11370864B2Polyfluorene-based polymer-polyvinylidene fluoride graft copolymer and element including the sameUNIV YONSEI IACF·Filed 2020·Granted Jun 28, 2022·0 cites·16 claims
- 1643US2024027910A1Underlayer composition for photolithography, multilayered structure formed using the same, and method of manufacturing semiconductor device using the sameUNIV INHA RES & BUSINESS FOUND·Filed 2023·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →