Inventor · disambiguated record
Jinting Jiu
Also filed as: JIU JINTING
10 granted patents·2 pending applications·6 citations·filing 2008–2021
79Inventor score
Top patents by PatentIndex Score
12 records- 0186US11278955B2Electrically conductive paste, laminated body, and method for bonding Cu substrate or Cu electrode to electrical conductorSENJU METAL INDUSTRY CO·Filed 2020·Granted Mar 22, 2022·2 cites·12 claims
- 0279US10201852B2Silver particle synthesizing method, silver particles, conductive paste producing method, and conductive pasteUNIV OSAKA·Filed 2015·Granted Feb 12, 2019·2 cites·10 claims
- 0375US10099291B2Method for producing metal nanowires and silver nanowiresSHOWA DENKO KK·Filed 2014·Granted Oct 16, 2018·2 cites·15 claims
- 0473US11217359B2Method for synthesizing copper-silver alloy, method for forming conduction part, copper-silver alloy, and conduction partSENJU METAL INDUSTRY CO·Filed 2018·Granted Jan 4, 2022·0 cites·2 claims
- 0572US12119131B2Method for synthesizing copper-silver alloy, method for forming conduction part, copper-silver alloy, and conduction partSENJU METAL INDUSTRY CO·Filed 2021·Granted Oct 15, 2024·0 cites·9 claims
- 0654US10651143B2Conductive paste having dilatancy, electrode connection structure including the paste, and method for producing the structureSHARP KK·Filed 2017·Granted May 12, 2020·0 cites·3 claims
- 0750US2012067405A1Titania Crystal, Process for Producing the Same, Layered Titania Substrate, and Dye-sensitized Solar CellJIU JINTING·Filed 2008·Application pending·0 cites
- 0849US12257622B2Joining material, production method for joining material, and joined bodySENJU METAL INDUSTRY CO·Filed 2020·Granted Mar 25, 2025·0 cites·13 claims
- 0946US10875097B2Silver particle producing method, silver particles, and silver pasteUNIV OSAKA·Filed 2016·Granted Dec 29, 2020·0 cites·13 claims
- 1044US2015030783A1Method for manufacturing transparent conductive patternSHOWA DENKO KK·Filed 2013·Application pending·0 cites
- 1142US10625344B2Method for producing copper particles, copper particles, and copper pasteUNIV OSAKA·Filed 2016·Granted Apr 21, 2020·0 cites·8 claims
- 1241US11710580B2Electrically conductive paste and sintered bodySENJU METAL INDUSTRY CO·Filed 2019·Granted Jul 25, 2023·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →