Inventor · disambiguated record
Katsuhiro Iwai
Also filed as: IWAI KATSUHIRO
11 granted patents·1 pending application·61 citations·filing 2015–2025
88Inventor score
Top patents by PatentIndex Score
12 records- 0196US11183444B2Packaging of a semiconductor device with a plurality of leadsROHM CO LTD·Filed 2020·Granted Nov 23, 2021·4 cites·20 claims
- 0294US11658100B2Packaging of a semiconductor device with a plurality of leadsROHM CO LTD·Filed 2021·Granted May 23, 2023·2 cites·20 claims
- 0393US12046541B2Packaging of a semiconductor device with a plurality of leadsROHM CO LTD·Filed 2023·Granted Jul 23, 2024·1 cites·20 claims
- 0492US2025364379A1Semiconductor deviceROHM CO LTD·Filed 2025·Application pending·0 cites
- 0587US12406910B2Packaging of a semiconductor device with a plurality of leadsROHM CO LTD·Filed 2024·Granted Sep 2, 2025·0 cites·20 claims
- 0682USD796459SPackaged semiconductor circuit moduleROHM CO LTD·Filed 2016·Granted Sep 5, 2017·24 cites·1 claims
- 0775USD813537SContact lens caseMENICON CO LTD·Filed 2015·Granted Mar 27, 2018·19 cites·1 claims
- 0870US10622285B2Semiconductor device with solders of different melting points and method of manufacturingROHM CO LTD·Filed 2017·Granted Apr 14, 2020·1 cites·9 claims
- 0967USD899081SContact lens caseMENICON CO LTD·Filed 2018·Granted Oct 20, 2020·10 cites·1 claims
- 1062US10886203B2Packaging structure with recessed outer and inner lead surfacesROHM CO LTD·Filed 2019·Granted Jan 5, 2021·0 cites·28 claims
- 1159US11037865B2Semiconductor with external electrodeROHM CO LTD·Filed 2020·Granted Jun 15, 2021·0 cites·19 claims
- 1256US10211130B2Semiconductor deviceROHM CO LTD·Filed 2017·Granted Feb 19, 2019·0 cites·39 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →