Inventor · disambiguated record
Hidetaka Miyake
Also filed as: MIYAKE HIDETAKA
25 granted patents·4 pending applications·325 citations·filing 1995–2021
96Inventor score
Files withMITSUBISHI ELECTRIC CORP15MIYAKE HIDETAKA5FUJI XEROX CO LTD2ITOKAZU ATSUSHI2JAPAN SCIENCE & TECH CORP2
Top patents by PatentIndex Score
29 records- 0189US8829383B2Wire electric discharge machine and wire electric discharge machining methodONODERA YASUO·Filed 2008·Granted Sep 9, 2014·10 cites·10 claims
- 0284US5919380AThree-dimensional electrical discharge machining method and apparatus utilizing NC controlMITSUBISHI ELECTRIC CORP·Filed 1996·Granted Jul 6, 1999·52 cites·36 claims
- 0381US5524067AImage processing device employing coding with edge information preservedFUJI XEROX CO LTD·Filed 1995·Granted Jun 4, 1996·81 cites·6 claims
- 0478US7518081B2Electric discharge machining apparatusMITSUBISHI ELECTRIC CORP·Filed 2004·Granted Apr 14, 2009·11 cites·14 claims
- 0577US6788019B2Electric discharge machining device and electric discharge machining methodMITSUBISHI ELECTRIC CORP·Filed 2001·Granted Sep 7, 2004·11 cites·21 claims
- 0676US6086684AElectric discharge surface treating method and apparatusJAPAN SCIENCE & TECH CORP·Filed 1998·Granted Jul 11, 2000·41 cites·20 claims
- 0775US10300542B2Wire electrical discharge machining apparatus and method of manufacturing semiconductor waferMITSUBISHI ELECTRIC CORP·Filed 2014·Granted May 28, 2019·3 cites·11 claims
- 0874US5804789ASurface treating method and apparatus by electric discharge machiningJAPAN SCIENCE & TECH CORP·Filed 1997·Granted Sep 8, 1998·38 cites·14 claims
- 0968US9833854B2Workpiece retainer, wire electric discharge machining device, thin-plate manufacturing method, and semiconductor-wafer manufacturing methodYUZAWA TAKASHI·Filed 2011·Granted Dec 5, 2017·3 cites·3 claims
- 1068US9089916B2Wire electric discharge machining apparatus, wire electric discharge machining method, thin plate manufacturing method, and semiconductor wafer manufacturing methodITOKAZU ATSUSHI·Filed 2011·Granted Jul 28, 2015·3 cites·8 claims
- 1161US9387548B2Wire-cut electrical discharge machining apparatus and semiconductor wafer manufacturing methodMIYAKE HIDETAKA·Filed 2011·Granted Jul 12, 2016·1 cites·13 claims
- 1260US6614234B1Electric discharge machineMITSUBISHI ELECTRIC CORP·Filed 2000·Granted Sep 2, 2003·4 cites·4 claims
- 1359US9950379B2Wire electric discharge machining apparatusMIYAKE HIDETAKA·Filed 2010·Granted Apr 24, 2018·1 cites·4 claims
- 1458US9050672B2Wire discharge-machining apparatus with parallel cutting wiresMIYAKE HIDETAKA·Filed 2009·Granted Jun 9, 2015·0 cites·9 claims
- 1558US6881918B2Electric discharge machining apparatusMITSUBISHI ELECTRIC CORP·Filed 2003·Granted Apr 19, 2005·5 cites·9 claims
- 1656US6781080B1Wire electric discharge machine with stored discharge energy threshold functionMITSUBISHI ELECTRIC CORP·Filed 2000·Granted Aug 24, 2004·5 cites·7 claims
- 1756US6622139B1Information retrieval apparatus and computer-readable recording medium having information retrieval program recorded thereinFUJI XEROX CO LTD·Filed 1999·Granted Sep 16, 2003·30 cites·7 claims
- 1854US9643270B2Wire discharge-machining apparatus with parallel cutting wiresMITSUBISHI ELECTRIC CORP·Filed 2015·Granted May 9, 2017·0 cites·4 claims
- 1954US6621033B2Electrical discharge machining apparatusMITSUBISHI ELECTRIC CORP·Filed 2001·Granted Sep 16, 2003·4 cites·15 claims
- 2052US2024207958A1Wire electrical discharge machining apparatus and wire electrical discharge machining methodMITSUBISHI ELECTRIC CORP·Filed 2021·Application pending·0 cites
- 2149US5837957AElectric discharge machining apparatusMITSUBISHI ELECTRIC CORP·Filed 1997·Granted Nov 17, 1998·12 cites·13 claims
- 2248US5973498AEDM with jump motion detecting reactive forceMITSUBISHI ELECTRIC CORP·Filed 1995·Granted Oct 26, 1999·9 cites·9 claims
- 2347US8664559B2Electrical discharge machineMIYAKE HIDETAKA·Filed 2005·Granted Mar 4, 2014·0 cites·15 claims
- 2446US10220459B2Wire electric discharge machining apparatus and manufacturing method for thin plate and manufacturing method for semiconductor wafer using wire electric discharge machining apparatusMITSUBISHI ELECTRIC CORP·Filed 2014·Granted Mar 5, 2019·0 cites·10 claims
- 2545US2023241698A1Wire spark machining apparatus and method for producing semiconductor waferMITSUBISHI ELECTRIC CORP·Filed 2020·Application pending·0 cites
- 2642US9707638B2Wire electric-discharge machining device, wire electric-discharge machining method, thin-plate manufacturing method, and semiconductor wafer manufacturing methodITOKAZU ATSUSHI·Filed 2012·Granted Jul 18, 2017·0 cites·5 claims
- 2740US2015053650A1Wire discharge machining apparatus and manufacturing method for semiconductor wafers using the sameMIYAKE HIDETAKA·Filed 2012·Application pending·0 cites
- 2838US2012312787A1Electrical discharge machining apparatus and electrical discharge machining methodNAKAGAWA TAKAYUKI·Filed 2011·Application pending·0 cites
- 2931US6147500AEDM with jump motion detecting reactive forceMITSUBISHI ELECTRIC CORP·Filed 1999·Granted Nov 14, 2000·1 cites·7 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →