Inventor · disambiguated record
Loon Kwang Tan
Also filed as: TAN LOON KWANG · TAN LOON LEE
9 granted patents·1 pending application·26 citations·filing 2001–2023
83Inventor score
Technology areasH10W
Top patents by PatentIndex Score
10 records- 0183US9425174B1Integrated circuit package with solderless interconnection structureALTERA CORP·Filed 2014·Granted Aug 23, 2016·8 cites·4 claims
- 0281US7989942B2IC package with capacitors disposed on an interposal layerALTERA CORP·Filed 2009·Granted Aug 2, 2011·10 cites·19 claims
- 0374US9401287B2Methods for packaging integrated circuitsALTERA CORP·Filed 2014·Granted Jul 26, 2016·3 cites·16 claims
- 0470US12191280B2Ceramic carrier and build up carrier for light-emitting diode (LED) arrayLUMILEDS LLC·Filed 2023·Granted Jan 7, 2025·0 cites·16 claims
- 0570US8525326B2IC package with capacitors disposed on an interposal layerTOONG TEIK TIONG·Filed 2011·Granted Sep 3, 2013·3 cites·20 claims
- 0661US11664347B2Ceramic carrier and build up carrier for light-emitting diode (LED) arrayLUMILEDS LLC·Filed 2020·Granted May 30, 2023·0 cites·13 claims
- 0752US8541263B1Thermoset molding for on-package decoupling in flip chipsTOONG TEIK TIONG·Filed 2008·Granted Sep 24, 2013·1 cites·21 claims
- 0849US9748197B2Methods for packaging integrated circuitsALTERA CORP·Filed 2016·Granted Aug 29, 2017·0 cites·10 claims
- 0945US9337240B1Integrated circuit package with a universal lead frameLEE GUAN KHAI·Filed 2010·Granted May 10, 2016·1 cites·19 claims
- 1031US2004169276A1Method of packaging a semiconductor chipFiled 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →