Inventor · disambiguated record
Sean T. Crowley
Also filed as: CROWLEY SEAN · CROWLEY SEAN M · CROWLEY SEAN T · CROWLEY SEAN TIMOTHY
24 granted patents·3 pending applications·1,397 citations·filing 1993–2019
97Inventor score
Top patents by PatentIndex Score
27 records- 0197US7045396B2Stackable semiconductor package and method for manufacturing sameAMKOR TECHNOLOGY INC·Filed 2003·Granted May 16, 2006·174 cites·19 claims
- 0294US6258629B1Electronic device package and leadframe and method for making the packageAMKOR TECHNOLOGY INC·Filed 1999·Granted Jul 10, 2001·213 cites·39 claims
- 0393US6630726B1Power semiconductor package with strapAMKOR TECHNOLOGY INC·Filed 2001·Granted Oct 7, 2003·102 cites·29 claims
- 0493US6605866B1Stackable semiconductor package and method for manufacturing sameAMKOR TECHNOLOGY INC·Filed 2000·Granted Aug 12, 2003·86 cites·25 claims
- 0592US6339252B1Electronic device package and leadframeAMKOR TECHNOLOGY INC·Filed 2000·Granted Jan 15, 2002·82 cites·45 claims
- 0691US6452278B1Low profile package for plural semiconductor diesAMKOR TECHNOLOGY INC·Filed 2000·Granted Sep 17, 2002·102 cites·21 claims
- 0790US6707138B2Semiconductor device including metal strap electrically coupled between semiconductor die and metal leadframeAMKOR TECHNOLOGY INC·Filed 2002·Granted Mar 16, 2004·78 cites·26 claims
- 0889US6756658B1Making two lead surface mounting high power microleadframe semiconductor packagesAMKOR TECHNOLOGY INC·Filed 2001·Granted Jun 29, 2004·67 cites·20 claims
- 0989US6521982B1Packaging high power integrated circuit devicesAMKOR TECHNOLOGY INC·Filed 2000·Granted Feb 18, 2003·52 cites·23 claims
- 1088US6873041B1Power semiconductor package with strapAMKOR TECHNOLOGY INC·Filed 2003·Granted Mar 29, 2005·52 cites·18 claims
- 1187US6459147B1Attaching semiconductor dies to substrates with conductive strapsAMKOR TECHNOLOGY INC·Filed 2000·Granted Oct 1, 2002·60 cites·7 claims
- 1287US6198163B1Thin leadframe-type semiconductor package having heat sink with recess and exposed surfaceAMKOR TECHNOLOGY INC·Filed 1999·Granted Mar 6, 2001·102 cites·17 claims
- 1384US6396130B1Semiconductor package having multiple dies with independently biased back surfacesAMKOR TECHNOLOGY INC·Filed 2001·Granted May 28, 2002·40 cites·30 claims
- 1483US8445984B2Micro-optical device packaging systemHASKETT BRADLEY MORGAN·Filed 2011·Granted May 21, 2013·7 cites·17 claims
- 1582US7936033B2Micro-optical device packaging systemTEXAS INSTRUMENTS INC·Filed 2008·Granted May 3, 2011·10 cites·17 claims
- 1681US6309916B1Method of molding plastic semiconductor packagesAMKOR TECHNOLOGY INC·Filed 1999·Granted Oct 30, 2001·74 cites·13 claims
- 1780US6639308B1Near chip size semiconductor packageAMKOR TECHNOLOGY INC·Filed 2000·Granted Oct 28, 2003·26 cites·7 claims
- 1874US6753597B1Encapsulated semiconductor package including chip paddle and leadsAMKOR TECHNOLOGY INC·Filed 2000·Granted Jun 22, 2004·23 cites·11 claims
- 1958US5455387ASemiconductor package with chip redistribution interposerOLIN CORP·Filed 1994·Granted Oct 3, 1995·26 cites·24 claims
- 2046US5318451AStackable interconnection socketAUGAT INC·Filed 1993·Granted Jun 7, 1994·11 cites·16 claims
- 2144US10916859B2Inflatable reflector antenna and related methodsMASSACHUSETTS INST TECHNOLOGY·Filed 2019·Granted Feb 9, 2021·0 cites·20 claims
- 2239US2007081472A1System for evolvable network designCHIANG MUNG·Filed 2005·Application pending·0 cites
- 2337US2007176287A1Thin integrated circuit device packages for improved radio frequency performanceCROWLEY SEAN T·Filed 2004·Application pending·0 cites
- 2434US8154111B2Near chip size semiconductor packageCROWLEY SEAN TIMOTHY·Filed 2003·Granted Apr 10, 2012·0 cites·18 claims
- 2534US2002125562A1Attaching semiconductor dies to substrates with conductive strapsFiled 2002·Application pending·0 cites
- 2633US5440803AIntegrated circuit extraction toolCYRIX CORP·Filed 1993·Granted Aug 15, 1995·6 cites·7 claims
- 2732US5429511AStackable interconnection socketAUGAT INC·Filed 1994·Granted Jul 4, 1995·4 cites·8 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →