Inventor · disambiguated record
Masahide Okamoto
Also filed as: OKAMOTO MASAHIDE
22 granted patents·7 pending applications·446 citations·filing 1989–2013
96Inventor score
Top patents by PatentIndex Score
29 records- 0195US7256501B2Semiconductor device and manufacturing method of the sameRENESAS TECH CORP·Filed 2005·Granted Aug 14, 2007·43 cites·13 claims
- 0294US6563225B2Product using Zn-Al alloy solderHITACHI LTD·Filed 2002·Granted May 13, 2003·110 cites·17 claims
- 0386US6555052B2Electron device and semiconductor deviceHITACHI LTD·Filed 2001·Granted Apr 29, 2003·42 cites·18 claims
- 0482US7579677B2Semiconductor device and method for manufacturing thereofRENESAS TECH CORP·Filed 2006·Granted Aug 25, 2009·11 cites·6 claims
- 0578US5097318ASemiconductor package and computer using itHITACHI LTD·Filed 1989·Granted Mar 17, 1992·50 cites·8 claims
- 0677US6774490B2Electronic deviceHITACHI LTD·Filed 2003·Granted Aug 10, 2004·22 cites·10 claims
- 0771US6585149B2Packaging method using lead-free solderHITACHI LTD·Filed 2001·Granted Jul 1, 2003·15 cites·17 claims
- 0871US5277723AMethod for producing multilayer ceramic body with convex side facesHITACHI LTD·Filed 1991·Granted Jan 11, 1994·48 cites·38 claims
- 0970US7722962B2Solder foil, semiconductor device and electronic deviceRENESAS TECH CORP·Filed 2001·Granted May 25, 2010·18 cites·5 claims
- 1070US7274103B2Semiconductor device and manufacturing method thereofRENESAS TECH CORP·Filed 2005·Granted Sep 25, 2007·4 cites·11 claims
- 1169US5731066AElectronic circuit deviceHITACHI LTD·Filed 1995·Granted Mar 24, 1998·38 cites·6 claims
- 1264US8356742B2Method for manufacturing a semiconductor device using an Al-Zn connecting materialHITACHI LTD·Filed 2011·Granted Jan 22, 2013·1 cites·9 claims
- 1362US6248960B1Ceramics substrate with electronic circuit and its manufacturing methodHITACHI LTD·Filed 2000·Granted Jun 19, 2001·9 cites·9 claims
- 1452US7131566B2Packaging method using lead-free solderHITACHI LTD·Filed 2003·Granted Nov 7, 2006·4 cites·22 claims
- 1550US2013127026A1Connecting material, method for manufacturing connecting material and semiconductor deviceIKEDA OSAMU·Filed 2013·Application pending·0 cites
- 1650US2008206590A1Connecting material, method for manufacturing connecting material, and semiconductor deviceIKEDA OSAMU·Filed 2007·Application pending·0 cites
- 1749US5825632ACircuit substrate and electronics computer, using sintered glass ceramicsHITACHI LTD·Filed 1995·Granted Oct 20, 1998·14 cites·18 claims
- 1847US6118671ACircuit substrate and manufacture thereof, ceramic composition for circuit substrate, and electronics computerHITACHI LTD·Filed 1998·Granted Sep 12, 2000·13 cites·44 claims
- 1946US7048173B2Wave soldering method using lead-free solder, apparatus therefor, and wave-soldered assemblyHITACHI LTD·Filed 2002·Granted May 23, 2006·2 cites·18 claims
- 2045US8389854B2Metal strip, connector, and method of manufacturing metal stripOKAMOTO MASAHIDE·Filed 2008·Granted Mar 5, 2013·0 cites·13 claims
- 2145US2013206607A1Lithium Extraction Method, and Metal Recovery MethodKOJIMA YASUKO·Filed 2011·Application pending·0 cites
- 2243US6658733B2Method of manufacturing via interconnection of glass-ceramic wiring boardHITACHI LTD·Filed 2001·Granted Dec 9, 2003·1 cites·3 claims
- 2343US6384347B2Glass-ceramic wiring boardHITACHI LTD·Filed 2001·Granted May 7, 2002·1 cites·8 claims
- 2443US2016146878A1Electronic Assembly for Prognostics of Solder JointHITACHI LTD·Filed 2013·Application pending·0 cites
- 2541US2013287654A1Leaching solution and metal recovery methodYAMADA YASUKO·Filed 2011·Application pending·0 cites
- 2639US2008122050A1Semiconductor Device And Production Method For Semiconductor DeviceIKEDA OSAMU·Filed 2005·Application pending·0 cites
- 2735US2003184986A1Circuit board and electronic device, and method of manufacturing sameHITACHI LTD·Filed 2003·Application pending·0 cites
- 2834US9393645B2Junction material, manufacturing method thereof, and manufacturing method of junction structureYAMAGUCHI TAKUTO·Filed 2011·Granted Jul 19, 2016·0 cites·17 claims
- 2934US8525330B2Connecting member for connecting a semiconductor element and a frame, formed of an Al-based layer and first and second Zn-based layers provided on surfaces of the Al-based layerOKAMOTO MASAHIDE·Filed 2010·Granted Sep 3, 2013·0 cites·3 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →