Inventor · disambiguated record
Dawn M. Lee
Also filed as: LEE DAWN · LEE DAWN M · LEE DAWN MICHELLE
19 granted patents·746 citations·filing 1995–2002
96Inventor score
Top patents by PatentIndex Score
19 records- 0194US5931719AMethod and apparatus for using pressure differentials through a polishing pad to improve performance in chemical mechanical polishingLSI LOGIC CORP·Filed 1997·Granted Aug 3, 1999·131 cites·17 claims
- 0290US6168508B1Polishing pad surface for improved process controlLSI LOGIC CORP·Filed 1997·Granted Jan 2, 2001·92 cites·25 claims
- 0390US5816900AApparatus for polishing a substrate at radially varying polish ratesLSI LOGIC CORP·Filed 1997·Granted Oct 6, 1998·98 cites·21 claims
- 0485US6179956B1Method and apparatus for using across wafer back pressure differentials to influence the performance of chemical mechanical polishingLSI LOGIC CORP·Filed 1999·Granted Jan 30, 2001·57 cites·4 claims
- 0585US6004193ADual purpose retaining ring and polishing pad conditionerLSI LOGIC CORP·Filed 1997·Granted Dec 21, 1999·70 cites·18 claims
- 0677US6391768B1Process for CMP removal of excess trench or via filler metal which inhibits formation of concave regions on oxide surface of integrated circuit structureLSI LOGIC CORP·Filed 2000·Granted May 21, 2002·28 cites·2 claims
- 0775US6607967B1Process for forming planarized isolation trench in integrated circuit structure on semiconductor substrateLSI LOGIC CORP·Filed 2000·Granted Aug 19, 2003·19 cites·16 claims
- 0874US5941761AShaping polishing pad to control material removal rate selectivelyLSI LOGIC CORP·Filed 1997·Granted Aug 24, 1999·37 cites·32 claims
- 0965US6066266AIn-situ chemical-mechanical polishing slurry formulation for compensation of polish pad degradationLSI LOGIC CORP·Filed 1998·Granted May 23, 2000·32 cites·31 claims
- 1065US5961375AShimming substrate holder assemblies to produce more uniformly polished substrate surfacesLSI LOGIC CORP·Filed 1997·Granted Oct 5, 1999·30 cites·23 claims
- 1164US6074288AModified carrier films to produce more uniformly polished substrate surfacesLSI LOGIC CORP·Filed 1997·Granted Jun 13, 2000·24 cites·28 claims
- 1262US6489242B1Process for planarization of integrated circuit structure which inhibits cracking of low dielectric constant dielectric material adjacent underlying raised structuresLSI LOGIC CORP·Filed 2000·Granted Dec 3, 2002·7 cites·2 claims
- 1361US5769696AChemical-mechanical polishing of thin materials using non-baked carrier filmADVANCED MICRO DEVICES INC·Filed 1995·Granted Jun 23, 1998·27 cites·7 claims
- 1460US5766058AChemical-mechanical polishing using curved carriersADVANCED MICRO DEVICES INC·Filed 1997·Granted Jun 16, 1998·21 cites·20 claims
- 1559US6531397B1Method and apparatus for using across wafer back pressure differentials to influence the performance of chemical mechanical polishingLSI LOGIC CORP·Filed 1998·Granted Mar 11, 2003·17 cites·5 claims
- 1657US6106371AEffective pad conditioningLSI LOGIC CORP·Filed 1997·Granted Aug 22, 2000·18 cites·32 claims
- 1756US5944585AUse of abrasive tape conveying assemblies for conditioning polishing padsLSI LOGIC CORP·Filed 1997·Granted Aug 31, 1999·18 cites·24 claims
- 1850US5863825AAlignment mark contrast enhancementLSI LOGIC CORP·Filed 1997·Granted Jan 26, 1999·19 cites·19 claims
- 1947US6713394B2Process for planarization of integrated circuit structure which inhibits cracking of low dielectric constant dielectric material adjacent underlying raised structuresLSI LOGIC CORP·Filed 2002·Granted Mar 30, 2004·1 cites·17 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →