Inventor · disambiguated record

Chiang-Han Day

Also filed as: DAY CHIANG-HAN

2 granted patents·46 citations·filing 1998–2001

64Inventor score

Technology areasH05K H10W

Files withIND TECH RES INST2

Top patents by PatentIndex Score

2 records

0174US6536653B2One-step bumping/bonding method for forming semiconductor packagesIND TECH RES INST·Filed 2001·Granted Mar 25, 2003·21 cites·27 claims
0257US6166435AFlip-chip ball grid array package with a heat slugIND TECH RES INST·Filed 1998·Granted Dec 26, 2000·25 cites·17 claims

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →