Inventor · disambiguated record
Randy Lo
Also filed as: LO RANDY · LO RANDY H Y · LO RANDY HSIAO-YU
8 granted patents·480 citations·filing 1995–2000
90Inventor score
Technology areasH10W
Top patents by PatentIndex Score
8 records- 0195US6414384B1Package structure stacking chips on front surface and back surface of substrateSILICON PREC IND CO LTD·Filed 2000·Granted Jul 2, 2002·131 cites·20 claims
- 0289US5691567AStructure for attaching a lead frame to a heat spreader/heat slug structureNAT SEMICONDUCTOR CORP·Filed 1995·Granted Nov 25, 1997·114 cites·8 claims
- 0386US5617297AEncapsulation filler technology for molding active electronics components such as IC cards or PCMCIA cardsNAT SEMICONDUCTOR CORP·Filed 1995·Granted Apr 1, 1997·93 cites·29 claims
- 0477US5796570AElectrostatic discharge protection packageNAT SEMICONDUCTOR CORP·Filed 1996·Granted Aug 18, 1998·67 cites·35 claims
- 0566US6479323B1Method for attaching a lead frame to a heat spreader/heat slug structureNAT SEMICONDUCTOR CORP·Filed 1997·Granted Nov 12, 2002·31 cites·21 claims
- 0657US6166435AFlip-chip ball grid array package with a heat slugIND TECH RES INST·Filed 1998·Granted Dec 26, 2000·25 cites·17 claims
- 0748US5773876ALead frame with electrostatic discharge protectionNAT SEMICONDUCTOR CORP·Filed 1996·Granted Jun 30, 1998·13 cites·20 claims
- 0837US5891760ALead frame with electrostatic discharge protectionNAT SEMICONDUCTOR CORP·Filed 1998·Granted Apr 6, 1999·6 cites·14 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →