Inventor · disambiguated record
Fang-Jun Leu
Also filed as: LEU FANG-JUN
9 granted patents·4 pending applications·177 citations·filing 1992–2018
89Inventor score
Top patents by PatentIndex Score
13 records- 0187US7411306B2Packaging structure and method of an image sensor moduleIND TECH RES INST·Filed 2005·Granted Aug 12, 2008·17 cites·11 claims
- 0282US7091592B2Stacked package for electronic elements and packaging method thereofIND TECH RES INST·Filed 2004·Granted Aug 15, 2006·30 cites·18 claims
- 0381US7572676B2Packaging structure and method of an image sensor moduleIND TECH RES INST·Filed 2007·Granted Aug 11, 2009·10 cites·12 claims
- 0478US7544529B2Image sensor packaging structure and method of manufacturing the sameIND TECH RES INST·Filed 2007·Granted Jun 9, 2009·7 cites·8 claims
- 0577US5243493AFanless convection cooling design for personal computersIND TECH RES INST·Filed 1992·Granted Sep 7, 1993·81 cites·18 claims
- 0676US10672677B2Semiconductor package structureIND TECH RES INST·Filed 2018·Granted Jun 2, 2020·2 cites·20 claims
- 0773US7417293B2Image sensor packaging structureIND TECH RES INST·Filed 2005·Granted Aug 26, 2008·5 cites·17 claims
- 0857US6166435AFlip-chip ball grid array package with a heat slugIND TECH RES INST·Filed 1998·Granted Dec 26, 2000·25 cites·17 claims
- 0944US11114387B2Electronic packaging structureIND TECH RES INST·Filed 2018·Granted Sep 7, 2021·0 cites·5 claims
- 1044US2017084521A1Semiconductor package structureIND TECH RES INST·Filed 2016·Application pending·0 cites
- 1144US2006220212A1Stacked package for electronic elementsCHEN SHOU-LUNG·Filed 2006·Application pending·0 cites
- 1237US2005236684A1Image sensor packaging structure and methodTAIWAN SEMICONDUCTOR MFG·Filed 2004·Application pending·0 cites
- 1336US2018233477A1Electronic packaging structureIND TECH RES INST·Filed 2017·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Fang-Jun Leu files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →