Inventor · disambiguated record
Hsin-Wei Wu
Also filed as: WU HSIN-WEI
16 granted patents·2 pending applications·32 citations·filing 1993–2024
89Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD6WU HSIN-WEI5SIEMENS IND SOFTWARE INC3TAIWAN SEMICONDUCTOR MFG2HIMAX TECH LTD1
Top patents by PatentIndex Score
18 records- 0190US9099495B1Formation of high quality fin in 3D structure by way of two-step implantationTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Aug 4, 2015·8 cites·20 claims
- 0279US11899367B2Dummy insertion for improving throughput of electron beam lithographyTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Feb 13, 2024·0 cites·20 claims
- 0373US11526081B2Dummy insertion for improving throughput of electron beam lithographyTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 13, 2022·0 cites·20 claims
- 0470US8461037B2Method for fabricating interconnections with carbon nanotubesWU HSIN-WEI·Filed 2011·Granted Jun 11, 2013·3 cites·7 claims
- 0563US11054748B2Dummy insertion for improving throughput of electron beam lithographyTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jul 6, 2021·0 cites·20 claims
- 0660US12467592B2Light string and ornamental article including the sameMARVELLOUS DAY INDUSTRIAL INTERNATIONAL LTD·Filed 2024·Granted Nov 11, 2025·0 cites·14 claims
- 0756US12511773B2Wafer image denoising and contour extraction for manufacturing process calibrationSIEMENS IND SOFTWARE INC·Filed 2022·Granted Dec 30, 2025·0 cites·20 claims
- 0856US12482090B2Wafer image defect detection and characterization for manufacturing process calibrationSIEMENS IND SOFTWARE INC·Filed 2022·Granted Nov 25, 2025·0 cites·14 claims
- 0956US9634126B2Formation of high quality Fin in 3D structure by way of two-step implantationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Apr 25, 2017·0 cites·20 claims
- 1056US2025111494A1Contour extraction of images with selection-based auto tuningSIEMENS IND SOFTWARE INC·Filed 2023·Application pending·0 cites
- 1155US10867566B2Method and source driving module for driving display panelHIMAX TECH LTD·Filed 2018·Granted Dec 15, 2020·0 cites·4 claims
- 1254US9425290B2Formation of high quality fin in 3D structure by way of two-step implantationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Aug 23, 2016·0 cites·20 claims
- 1354USD627494SLED bulbWU HSIN-WEI·Filed 2010·Granted Nov 16, 2010·9 cites·1 claims
- 1454US6974354B2Bulb assemblyWU HSIN-WEI·Filed 2004·Granted Dec 13, 2005·9 cites·1 claims
- 1551US9343312B2High temperature intermittent ion implantationTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted May 17, 2016·0 cites·20 claims
- 1648US10049856B2High temperature intermittent ion implantationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Aug 14, 2018·0 cites·20 claims
- 1738US2011210660A1Led bulb assembliesWU HSIN-WEI·Filed 2010·Application pending·0 cites
- 1829US5314348AInner lock type fastening construction of a light bulb holderWU HSIN WEI·Filed 1993·Granted May 24, 1994·3 cites·1 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →