Inventor · disambiguated record
Marc Alan Mangrum
Also filed as: MANGRUM MARC A · MANGRUM MARC ALAN
36 granted patents·3 pending applications·1,157 citations·filing 2003–2023
98Inventor score
Files withFREESCALE SEMICONDUCTOR INC15AMKOR TECHNOLOGY INC10AMKOR TECH SINGAPORE HOLDING PTE LTD5MANGRUM MARC ALAN3BURCH KENNETH R2
Top patents by PatentIndex Score
39 records- 0198US7588951B2Method of packaging a semiconductor device and a prefabricated connectorFREESCALE SEMICONDUCTOR INC·Filed 2006·Granted Sep 15, 2009·74 cites·9 claims
- 0298US7476563B2Method of packaging a device using a dielectric layerFREESCALE SEMICONDUCTOR INC·Filed 2006·Granted Jan 13, 2009·80 cites·20 claims
- 0398US6921975B2Circuit device with at least partial packaging, exposed active surface and a voltage reference planeFREESCALE SEMICONDUCTOR INC·Filed 2003·Granted Jul 26, 2005·233 cites·23 claims
- 0498US6838776B2Circuit device with at least partial packaging and method for formingFREESCALE SEMICONDUCTOR INC·Filed 2003·Granted Jan 4, 2005·314 cites·43 claims
- 0597US7655502B2Method of packaging a semiconductor device and a prefabricated connectorFREESCALE SEMICONDUCTOR INC·Filed 2009·Granted Feb 2, 2010·50 cites·7 claims
- 0697US7651889B2Electromagnetic shield formation for integrated circuit die packageFREESCALE SEMICONDUCTOR INC·Filed 2007·Granted Jan 26, 2010·100 cites·20 claims
- 0797US7361987B2Circuit device with at least partial packaging and method for formingFREESCALE SEMICONDUCTOR INC·Filed 2005·Granted Apr 22, 2008·75 cites·15 claims
- 0895US9362209B1Shielding technique for semiconductor package including metal lidMANGRUM MARC ALAN·Filed 2012·Granted Jun 7, 2016·32 cites·18 claims
- 0995US9153543B1Shielding technique for semiconductor package including metal lid and metalized contact areaMANGRUM MARC ALAN·Filed 2012·Granted Oct 6, 2015·29 cites·20 claims
- 1095US8633575B1IC package with integrated electrostatic discharge protectionMANGRUM MARC ALAN·Filed 2012·Granted Jan 21, 2014·23 cites·20 claims
- 1194US10923800B2Packaged electronic device having integrated antenna and locking structureAMKOR TECHNOLOGY INC·Filed 2020·Granted Feb 16, 2021·3 cites·20 claims
- 1293US9966652B2Packaged electronic device having integrated antenna and locking structureAMKOR TECHNOLOGY INC·Filed 2015·Granted May 8, 2018·8 cites·22 claims
- 1392US10566680B2Packaged electronic device having integrated antenna and locking structureAMKOR TECHNOLOGY INC·Filed 2018·Granted Feb 18, 2020·5 cites·20 claims
- 1492US7892882B2Methods and apparatus for a semiconductor device package with improved thermal performanceFREESCALE SEMICONDUCTOR INC·Filed 2006·Granted Feb 22, 2011·26 cites·10 claims
- 1590US7098073B1Method for stacking an integrated circuit on another integrated circuitFREESCALE SEMICONDUCTOR INC·Filed 2005·Granted Aug 29, 2006·21 cites·20 claims
- 1689US8044494B2Stackable molded packages and methods of making the sameFREESCALE SEMICONDUCTOR INC·Filed 2009·Granted Oct 25, 2011·19 cites·17 claims
- 1788US7196427B2Structure having an integrated circuit on another integrated circuit with an intervening bent adhesive elementFREESCALE SEMICONDUCTOR INC·Filed 2005·Granted Mar 27, 2007·18 cites·20 claims
- 1886US10032699B1Flip chip self-alignment features for substrate and leadframe applicationsAMKOR TECHNOLOGY INC·Filed 2014·Granted Jul 24, 2018·5 cites·22 claims
- 1985US11658099B2Flip chip curved sidewall self-alignment features for substrate and method for manufacturing the self-alignment featuresAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2020·Granted May 23, 2023·1 cites·18 claims
- 2083US8097494B2Method of making an integrated circuit package with shielding via ring structureTANG JINBANG·Filed 2010·Granted Jan 17, 2012·6 cites·16 claims
- 2182US12062833B2Packaged electronic device having integrated antenna and locking structureAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2023·Granted Aug 13, 2024·0 cites·20 claims
- 2282US10861776B2Flip chip self-alignment features for substrate and leadframe applicationsAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2018·Granted Dec 8, 2020·2 cites·17 claims
- 2382US10211128B2Semiconductor package having inspection structure and related methodsAMKOR TECHNOLOGY INC·Filed 2017·Granted Feb 19, 2019·3 cites·20 claims
- 2481US12438067B2Flip chip self-alignment features for substrate and leadframe applications and method of manufacturing the flip chip self-alignment featuresAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2023·Granted Oct 7, 2025·0 cites·19 claims
- 2579US7808258B2Test interposer having active circuit component and method thereforFREESCALE SEMICONDUCTOR INC·Filed 2008·Granted Oct 5, 2010·9 cites·20 claims
- 2678US7807511B2Method of packaging a device having a multi-contact elastomer connector contact area and device thereofFREESCALE SEMICONDUCTOR INC·Filed 2006·Granted Oct 5, 2010·8 cites·16 claims
- 2771US11677135B2Packaged electronic device having integrated antenna and locking structureAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2021·Granted Jun 13, 2023·0 cites·20 claims
- 2871US10490487B2Semiconductor package having inspection structure and related methodsAMKOR TECHNOLOGY INC·Filed 2018·Granted Nov 26, 2019·1 cites·20 claims
- 2969US10032726B1Embedded vibration management systemAMKOR TECHNOLOGY INC·Filed 2013·Granted Jul 24, 2018·2 cites·23 claims
- 3069US9917039B2Method of forming a semiconductor package with conductive interconnect frame and structureAMKOR TECHNOLOGY INC·Filed 2016·Granted Mar 13, 2018·2 cites·16 claims
- 3168US8072062B2Circuit device with at least partial packaging and method for formingLEAL GEORGE R·Filed 2008·Granted Dec 6, 2011·3 cites·14 claims
- 3267US7696016B2Method of packaging a device having a tangible element and device thereofFREESCALE SEMICONDUCTOR INC·Filed 2006·Granted Apr 13, 2010·2 cites·9 claims
- 3364US9870985B1Semiconductor package with clip alignment notchAMKOR TECHNOLOGY INC·Filed 2016·Granted Jan 16, 2018·1 cites·22 claims
- 3457US8415203B2Method of forming a semiconductor package including two devicesBURCH KENNETH R·Filed 2008·Granted Apr 9, 2013·2 cites·21 claims
- 3555US10861798B2Embedded vibration management system having an array of vibration absorbing structuresAMKOR TECHNOLOGY INC·Filed 2018·Granted Dec 8, 2020·0 cites·20 claims
- 3648US2008108179A1Stackable molded packages and methods of making the sameFREESCALE SEMICONDUCTOR INC·Filed 2008·Application pending·0 cites
- 3743US8059380B2Package level ESD protection and method thereforAJURIA SERGIO A·Filed 2008·Granted Nov 15, 2011·0 cites·4 claims
- 3843US2007141751A1Stackable molded packages and methods of making the sameMISTRY ADDI B·Filed 2005·Application pending·0 cites
- 3939US2008119004A1Method of packaging a device having a keypad switch pointBURCH KENNETH R·Filed 2006·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →