Inventor · disambiguated record
Bo-Tsung Tsai
Also filed as: TSAI BO-TSUNG
19 granted patents·3 pending applications·21 citations·filing 2015–2024
91Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD22
Top patents by PatentIndex Score
22 records- 0195US10672820B2Hybrid bonded structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jun 2, 2020·13 cites·20 claims
- 0289US2025160007A1Method of making complementary metal-oxide-semiconductor image sensorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0386US10854668B2Complementary metal-oxide-semiconductor image sensorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 1, 2020·2 cites·20 claims
- 0485US2024371909A1Method for fabricating image sensorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0583US12183767B2Complementary metal-oxide-semiconductor image sensor and method of makingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Dec 31, 2024·0 cites·20 claims
- 0681US9806116B2Complementary metal grid and deep trench isolation in CIS applicationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Oct 31, 2017·3 cites·20 claims
- 0780US10672824B2Image sensorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jun 2, 2020·2 cites·20 claims
- 0878US12080746B2Method for fabricating image sensorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Sep 3, 2024·0 cites·19 claims
- 0976US12074190B2Image sensor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Aug 27, 2024·0 cites·20 claims
- 1076US11557626B2Complementary metal-oxide-semiconductor image sensor and method of makingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jan 17, 2023·0 cites·20 claims
- 1176US11205674B2Method for fabricating image sensorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 21, 2021·0 cites·20 claims
- 1276US11183532B2Image sensor and method for fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Nov 23, 2021·0 cites·20 claims
- 1375US11581360B2Complementary metal-oxide-semiconductor image sensor and method of makingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Feb 14, 2023·0 cites·20 claims
- 1474US2024313026A1Method for fabricating hybrid bonded structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1573US10490596B2Method for fabricating an image sensorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Nov 26, 2019·1 cites·20 claims
- 1671US11329094B2Image sensorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted May 10, 2022·0 cites·20 claims
- 1770US12021103B2Method for fabricating hybrid bonded structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jun 25, 2024·0 cites·20 claims
- 1863US11437422B2Hybrid bonded structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Sep 6, 2022·0 cites·20 claims
- 1962US10297636B2Method for fabricating complementary metal-oxide-semiconductor image sensorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted May 21, 2019·0 cites·20 claims
- 2054US11282707B2Method and system of estimating wafer crystalline orientationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Mar 22, 2022·0 cites·20 claims
- 2153US10490587B2CIS structure with complementary metal grid and deep trench isolation and method for manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Nov 26, 2019·0 cites·20 claims
- 2230US10109668B2Pixel structure of an image sensor and fabrication method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Oct 23, 2018·0 cites·20 claims
Join the waitlist — get patent alerts
Get an alert when Bo-Tsung Tsai files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →