Inventor · disambiguated record
Michael S. Sandlin
Also filed as: SANDLIN MICHAEL · SANDLIN MICHAEL S
16 granted patents·3 pending applications·230 citations·filing 2001–2021
94Inventor score
Top patents by PatentIndex Score
19 records- 0198US10124559B2Kinetically limited nano-scale diffusion bond structures and methodsMEDTRONIC INC·Filed 2015·Granted Nov 13, 2018·24 cites·30 claims
- 0297US9120287B2Techniques for bonding substrates using an intermediate layerMEDTRONIC INC·Filed 2014·Granted Sep 1, 2015·37 cites·17 claims
- 0396US8796109B2Techniques for bonding substrates using an intermediate layerRUBEN DAVID A·Filed 2010·Granted Aug 5, 2014·36 cites·37 claims
- 0491US11485670B2Hermetic conductive feedthroughs for a semiconductor waferMEDTRONIC INC·Filed 2019·Granted Nov 1, 2022·6 cites·20 claims
- 0591US9171721B2Laser assisted direct bondingDANZL RALPH B·Filed 2010·Granted Oct 27, 2015·22 cites·21 claims
- 0690US9865533B2Feedthrough assembliesMEDTRONIC INC·Filed 2015·Granted Jan 9, 2018·6 cites·18 claims
- 0789US7175802B2Refurbishing spent sputtering targetsHERAEUS INC·Filed 2002·Granted Feb 13, 2007·53 cites·6 claims
- 0888US9688053B2Devices formed with techniques for bonding substrates using an intermediate layerMEDTRONIC INC·Filed 2015·Granted Jun 27, 2017·4 cites·21 claims
- 0987US9832867B2Embedded metallic structures in glassMEDTRONIC INC·Filed 2015·Granted Nov 28, 2017·5 cites·10 claims
- 1085US9968794B2Implantable medical device system including feedthrough assembly and method of forming sameMEDTRONIC INC·Filed 2015·Granted May 15, 2018·6 cites·27 claims
- 1184US10981355B2Kinetically limited nano-scale diffusion bond structures and methodsMEDTRONIC INC·Filed 2018·Granted Apr 20, 2021·1 cites·30 claims
- 1279US6797137B2Mechanically alloyed precious metal magnetic sputtering targets fabricated using rapidly solidfied alloy powders and elemental Pt metalHERAEUS INC·Filed 2001·Granted Sep 28, 2004·21 cites·11 claims
- 1376US12454117B2Kinetically limited nano-scale diffusion bond structures and methodsMEDTRONIC INC·Filed 2021·Granted Oct 28, 2025·0 cites·30 claims
- 1470US10464836B2Hermetic conductive feedthroughs for a semiconductor waferMEDTRONIC INC·Filed 2013·Granted Nov 5, 2019·1 cites·30 claims
- 1565US7229588B2Mechanically alloyed precious metal magnetic sputtering targets fabricated using rapidly solidified alloy powders and elemental Pt metalHERAEUS INC·Filed 2004·Granted Jun 12, 2007·8 cites·24 claims
- 1657US2018263132A1Implantable medical devices and methods of forming sameMEDTRONIC INC·Filed 2018·Application pending·0 cites
- 1755US10535596B2Feedthrough assemblies and methods of forming sameMEDTRONIC INC·Filed 2017·Granted Jan 14, 2020·0 cites·20 claims
- 1847US2008277383A1Apparatus for removing debris from the cutting gap of a work piece on a wire electronic discharge machine and method thereforSANDLIN MICHAEL·Filed 2007·Application pending·0 cites
- 1940US2004062675A1Fabrication of ductile intermetallic sputtering targetsFiled 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →