Inventor · disambiguated record
Mon-Chin Tsai
Also filed as: TSAI MON C · TSAI MON-CHIN
5 granted patents·8 pending applications·28 citations·filing 2004–2008
72Inventor score
Files withADVANCED SEMICONDUCTOR ENG4TSAI MON-CHIN4GRACE SEMICONDUCTOR MFG CORP2ADVANCED CHIP ENG TECH INC1WOO BEEN-JON1
Top patents by PatentIndex Score
13 records- 0172US7391118B2Integrated circuit device with embedded passive component by flip-chip connection and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2004·Granted Jun 24, 2008·22 cites·6 claims
- 0271US7670876B2Integrated circuit device with embedded passive component by flip-chip connection and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2008·Granted Mar 2, 2010·6 cites·9 claims
- 0344US2009166873A1Inter-connecting structure for semiconductor device package and method of the sameADVANCED CHIP ENG TECH INC·Filed 2007·Application pending·0 cites
- 0438US2006134884A1Wafer structure, chip structure, and fabricating process thereofADVANCED SEMICONDUCTOR ENG·Filed 2005·Application pending·0 cites
- 0536US6998868B2Test key for bridge and continuity testingGRACE SEMICONDUCTOR MFG CORP·Filed 2004·Granted Feb 14, 2006·0 cites·15 claims
- 0636US2005059235A1Method for improving oxide layer flatnessFiled 2004·Application pending·0 cites
- 0736US2006134881A1Method of forming trench isolation device capable of reducing corner recessWOO BEEN-JON·Filed 2004·Application pending·0 cites
- 0834US7332741B2Multidirectional leakage path test structureGRACE SEMICONDUCTOR MFG CORP·Filed 2004·Granted Feb 19, 2008·0 cites·17 claims
- 0933US2005181538A1Semiconductor device for wire-bonding and flip-chip bonding package and manufacturing method thereofADVANCED SEMICONDUCTOR ENG·Filed 2004·Application pending·0 cites
- 1032US8669658B2Crosstalk-free WLCSP structure for high frequency applicationTSAI MON-CHIN·Filed 2007·Granted Mar 11, 2014·0 cites·11 claims
- 1131US2006199306A1Chip structure and manufacturing process thereofTSAI MON-CHIN·Filed 2005·Application pending·0 cites
- 1231US2006197191A1Chip structure and wafer structureTSAI MON-CHIN·Filed 2005·Application pending·0 cites
- 1330US2007281403A1Method of enhancing gate lithography performance by polysilicon chemical-mechanical polishingTSAI MON-CHIN·Filed 2006·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →