Inventor · disambiguated record
Hiroyuki Morinaka
Also filed as: MORINAKA HIROYUKI
14 granted patents·1 pending application·213 citations·filing 1995–2016
92Inventor score
Files withMITSUBISHI ELECTRIC CORP9KYODO PRINTING CO LTD2MITSUI MINING & SMELTING CO2RENESAS TECH CORP2
Top patents by PatentIndex Score
15 records- 0190US5781062ASemiconductor integrated circuitMITSUBISHI ELECTRIC CORP·Filed 1996·Granted Jul 14, 1998·85 cites·22 claims
- 0283US6820107B1Square root extraction circuit and floating-point square root extraction deviceRENESAS TECH CORP·Filed 2000·Granted Nov 16, 2004·38 cites·3 claims
- 0363US5633524AGate array semiconductor integrated circuit deviceMITSUBISHI ELECTRIC CORP·Filed 1995·Granted May 27, 1997·20 cites·20 claims
- 0460US6375784B1Method of manufacturing reversible heat-sensitive recording medium and reversible heat-sensitive recording medium manufactured therebyKYODO PRINTING CO LTD·Filed 2000·Granted Apr 23, 2002·7 cites·7 claims
- 0556US5646555APipeline structure using positive edge and negative edge flip-flops to decrease the size of a logic blockMITSUBISHI ELECTRIC CORP·Filed 1995·Granted Jul 8, 1997·15 cites·7 claims
- 0651US10486231B2Silver-coated copper powderMITSUI MINING & SMELTING CO·Filed 2016·Granted Nov 26, 2019·0 cites·20 claims
- 0745US5631860ACarry Selecting system type adderMITSUBISHI ELECTRIC CORP·Filed 1995·Granted May 20, 1997·19 cites·6 claims
- 0845US2005108698A1Assembler capable of reducing size of object code, and processor for executing the object codeRENESAS TECH CORP·Filed 2004·Application pending·0 cites
- 0941US5747847ASemiconductor integrated circuit device, method for manufacturing the same, and logical circuitMITSUBISHI ELECTRIC CORP·Filed 1996·Granted May 5, 1998·7 cites·10 claims
- 1038US5859800AData holding circuit and buffer circuitMITSUBISHI ELECTRIC CORP·Filed 1997·Granted Jan 12, 1999·6 cites·10 claims
- 1136US6005422ASemiconductor integrated circuit and consumed power reducing methodMITSUBISHI ELECTRIC CORP·Filed 1996·Granted Dec 21, 1999·8 cites·17 claims
- 1233US5891765AMethod of fabricating a gate array semiconductor integrated circuit deviceMITSUBISHI ELECTRIC CORP·Filed 1997·Granted Apr 6, 1999·2 cites·5 claims
- 1331US6148318ASquare root extraction circuit and floating-point square root extraction deviceMITSUBISHI ELECTRIC CORP·Filed 1997·Granted Nov 14, 2000·3 cites·11 claims
- 1430US10357824B2Dendritic silver powderMITSUI MINING & SMELTING CO·Filed 2016·Granted Jul 23, 2019·0 cites·4 claims
- 1530US6001518AReversible heat-sensitive recording material with high color development and image stabilization capabilitiesKYODO PRINTING CO LTD·Filed 1998·Granted Dec 14, 1999·3 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →