Inventor · disambiguated record
Hsin-Lin Wu
Also filed as: WU HSIN-LIN
3 granted patents·1 pending application·3 citations·filing 2019–2023
53Inventor score
Top patents by PatentIndex Score
4 records- 0178US11081413B2Semiconductor package with inner and outer cavitiesADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Aug 3, 2021·3 cites·20 claims
- 0264US2023383399A1Structures and methods for processing a semiconductor substrateTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 0358US12286706B2Structures and methods for processing a semiconductor substrateTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Apr 29, 2025·0 cites·20 claims
- 0443US11174157B2Semiconductor device packages and methods of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Nov 16, 2021·0 cites·16 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →