Inventor · disambiguated record
Chee Chian Lim
Also filed as: LIM CHEE C · LIM CHEE CHIAN
12 granted patents·2 pending applications·196 citations·filing 2005–2014
88Inventor score
Top patents by PatentIndex Score
14 records- 0197US7553745B2Integrated circuit package, panel and methods of manufacturing the sameINFINEON TECHNOLOGIES AG·Filed 2007·Granted Jun 30, 2009·174 cites·9 claims
- 0276US7956459B2Semiconductor device and method of assemblyINFINEON TECHNOLOGIES AG·Filed 2005·Granted Jun 7, 2011·6 cites·17 claims
- 0372US8049311B2Electronic component and method for its productionINFINEON TECHNOLOGIES AG·Filed 2009·Granted Nov 1, 2011·8 cites·11 claims
- 0464US8373279B2Die packageINFINEON TECHNOLOGIES AG·Filed 2010·Granted Feb 12, 2013·2 cites·24 claims
- 0563US8907501B2Method of packaging a dieINFINEON TECHNOLOGIES AG·Filed 2013·Granted Dec 9, 2014·1 cites·22 claims
- 0662US8563357B2Method of packaging a dieLIM CHEE CHIAN·Filed 2008·Granted Oct 22, 2013·2 cites·23 claims
- 0762US7618845B2Fabrication of an integrated circuit packageINFINEON TECHNOLOGIES AG·Filed 2006·Granted Nov 17, 2009·2 cites·19 claims
- 0859US8637977B2Semiconductor device and method of packaging a semiconductor device with a clipINFINEON TECHNOLOGIES AG·Filed 2013·Granted Jan 28, 2014·1 cites·18 claims
- 0953US2015091195A1Method of Packaging a DieINFINEON TECHNOLOGIES AG·Filed 2014·Application pending·0 cites
- 1046USRE43818EFabrication of an integrated circuit packageLIM CHEE CHIAN·Filed 2011·Granted Nov 20, 2012·0 cites·20 claims
- 1146US7944050B2Integrated circuit device and a method of making the integrated circuit deviceINFINEON TECHNOLOGIES AG·Filed 2008·Granted May 17, 2011·0 cites·19 claims
- 1243US8486757B2Semiconductor device and method of packaging a semiconductor device with a clipLIM BOON HUAT·Filed 2009·Granted Jul 16, 2013·0 cites·22 claims
- 1338US8604595B2Multi-chip electronic package with reduced stressLIM CHEE CHIAN·Filed 2008·Granted Dec 10, 2013·0 cites·20 claims
- 1432US2008105960A1Integrated Circuit Package and Method for Manufacturing an Integrated Circuit PackageSEE BENG K·Filed 2008·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →