Inventor · disambiguated record
Toshiaki Sasano
Also filed as: SASANO TOSHIAKI
9 granted patents·131 citations·filing 1994–2002
89Inventor score
Technology areasH10W
Files withSHINKAWA KK9
Top patents by PatentIndex Score
9 records- 0181US6464126B2Bonding apparatus and bonding methodSHINKAWA KK·Filed 2001·Granted Oct 15, 2002·32 cites·10 claims
- 0278US6467673B2Bonding apparatus and bonding methodSHINKAWA KK·Filed 2000·Granted Oct 22, 2002·27 cites·9 claims
- 0367US6762848B2Offset measurement method, tool position detection method and bonding apparatusSHINKAWA KK·Filed 2001·Granted Jul 13, 2004·13 cites·4 claims
- 0458US5615821AWire bonding method and apparatusSHINKAWA KK·Filed 1995·Granted Apr 1, 1997·26 cites·3 claims
- 0551US6814121B2Bonding apparatusSHINKAWA KK·Filed 2002·Granted Nov 9, 2004·4 cites·10 claims
- 0645US5862974AWire bonding method and apparatusSHINKAWA KK·Filed 1996·Granted Jan 26, 1999·12 cites·1 claims
- 0739US5579984ABonding coordinate teaching method and teaching meansSHINKAWA KK·Filed 1995·Granted Dec 3, 1996·10 cites·4 claims
- 0832US6250534B1Wire bonding methodSHINKAWA KK·Filed 1998·Granted Jun 26, 2001·3 cites·1 claims
- 0930US5583756ATeaching method and teaching system for a bonding coordinateSHINKAWA KK·Filed 1994·Granted Dec 10, 1996·4 cites·2 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →