Inventor · disambiguated record
Peter D. Scovell
Also filed as: SCOVELL PETER D
15 granted patents·255 citations·filing 1980–1990
94Inventor score
Top patents by PatentIndex Score
15 records- 0181US4772571AProcess of self aligned nitridation of TiSi2 to form TiN/TiSi2 contactSTC PLC·Filed 1987·Granted Sep 20, 1988·63 cites·6 claims
- 0270US4350537ASemiconductor annealing by pulsed heatingITT·Filed 1980·Granted Sep 21, 1982·30 cites·8 claims
- 0366US4490183AMethod of reactivating implanted dopants and oxidation semiconductor wafers by microwavesITT·Filed 1982·Granted Dec 25, 1984·22 cites·7 claims
- 0462US4745080AMethod of making a self-aligned bipolar transistor with composite maskingSTC PLC·Filed 1986·Granted May 17, 1988·23 cites·7 claims
- 0559US4914048AMethod of making Bicmos devicesSTC PLC·Filed 1987·Granted Apr 3, 1990·14 cites·6 claims
- 0655US4468308AMetallic silicide productionITT·Filed 1983·Granted Aug 28, 1984·19 cites·10 claims
- 0750US4965216AMethod of fabricating a bi-CMOS deviceSTC PLC·Filed 1990·Granted Oct 23, 1990·15 cites·2 claims
- 0850US4490182ASemiconductor processing technique for oxygen doping of siliconITT·Filed 1981·Granted Dec 25, 1984·14 cites·10 claims
- 0947US5055419AMethod of manufacturing a bipolar transistorSTC PLC·Filed 1988·Granted Oct 8, 1991·12 cites·5 claims
- 1045US4683363AMicrowave apparatus for processing semiconductorITT·Filed 1986·Granted Jul 28, 1987·11 cites·9 claims
- 1143US4563805AManufacture of MOSFET with metal silicide contactSTANDARD TELEPHONES CABLES LTD·Filed 1985·Granted Jan 14, 1986·10 cites·4 claims
- 1240US4916517ASemiconductor devicesSTC PLC·Filed 1988·Granted Apr 10, 1990·8 cites·3 claims
- 1337US4755487AMethod for making bipolar transistors using rapid thermal annealingSTC PLC·Filed 1986·Granted Jul 5, 1988·11 cites·1 claims
- 1433US4849364ASemiconductor devicesSTC PLC·Filed 1987·Granted Jul 18, 1989·3 cites·3 claims
- 1529US4845532ASemiconductor devicesSTC PLC·Filed 1988·Granted Jul 4, 1989·0 cites·3 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →