Inventor · disambiguated record
Zhengying Wei
Also filed as: WEI ZHENGYING
5 granted patents·4 pending applications·5 citations·filing 2007–2024
65Inventor score
Files withSHANGHAI HUALI MICROELECT CORP6LIU CHIKANG1SEMICONDUCTOR MFG INT SHANGHAI1UNIV XI AN JIAOTONG1
Top patents by PatentIndex Score
9 records- 0185US11342217B1Method for improving HDP filling defects through STI etching processSHANGHAI HUALI MICROELECT CORP·Filed 2021·Granted May 24, 2022·2 cites·3 claims
- 0256US8507378B2Method and structure for self aligned contact for integrated circuitsLIU CHIKANG·Filed 2010·Granted Aug 13, 2013·3 cites·16 claims
- 0356US2025107251A1Method for making image sensorSHANGHAI HUALI MICROELECT CORP·Filed 2024·Application pending·0 cites
- 0455US12299866B2Method for automatically detecting wafer backside brightfield image anomalySHANGHAI HUALI MICROELECT CORP·Filed 2022·Granted May 13, 2025·0 cites·7 claims
- 0553US2024128296A1Double-layer stacked cmos image sensorSHANGHAI HUALI MICROELECT CORP·Filed 2023·Application pending·0 cites
- 0650US2024153980A1Cmos image sensor and method for manufacturing sameSHANGHAI HUALI MICROELECT CORP·Filed 2023·Application pending·0 cites
- 0749US12179268B2Dynamic slicing method for additive manufacturing forming with variable forming directionUNIV XI AN JIAOTONG·Filed 2021·Granted Dec 31, 2024·0 cites·9 claims
- 0848US11508859B2Method for forming doped epitaxial layer of contact image sensorSHANGHAI HUALI MICROELECT CORP·Filed 2021·Granted Nov 22, 2022·0 cites·9 claims
- 0940US2008081433A1Method for Forming a Shallow Trench Isolation StructureSEMICONDUCTOR MFG INT SHANGHAI·Filed 2007·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →