Inventor · disambiguated record
Dave Hui
Also filed as: HUI DAVE
7 granted patents·4 pending applications·6 citations·filing 2012–2024
73Inventor score
Files withDU PONT5DOWA ELECTRONICS MATERIALS CO LTD2DUPONT ELECTRONIC MAT HOLDING INC2KIRK DANIEL1SOLAR PASTE LLC1
Top patents by PatentIndex Score
11 records- 0180US11450447B2Fine silver particle dispersionSOLAR PASTE LLC·Filed 2017·Granted Sep 20, 2022·2 cites·6 claims
- 0275US9245664B2Conductive metal inkKIRK DANIEL·Filed 2012·Granted Jan 26, 2016·3 cites·15 claims
- 0367US2025387872A1Polishing pad with thermal management featuresDUPONT ELECTRONIC MAT HOLDING INC·Filed 2024·Application pending·0 cites
- 0466US11072715B2Fine silver particle dispersionDU PONT·Filed 2019·Granted Jul 27, 2021·0 cites·15 claims
- 0566US2025387871A1Polishing pad having filled non-porous sub-padDUPONT ELECTRONIC MAT HOLDING INC·Filed 2024·Application pending·0 cites
- 0664US9840651B2Flowable compositions with low temperature curing to form thermally conductive pathways in electronics type applications and methods relating theretoDU PONT·Filed 2015·Granted Dec 12, 2017·1 cites·8 claims
- 0762US11227702B2Fine silver particle dispersionDOWA ELECTRONICS MATERIALS CO LTD·Filed 2019·Granted Jan 18, 2022·0 cites·19 claims
- 0860US9245665B2Conductive metal compositionDU PONT·Filed 2013·Granted Jan 26, 2016·0 cites·14 claims
- 0954US11441010B2Fine silver particle dispersionDOWA ELECTRONICS MATERIALS CO LTD·Filed 2017·Granted Sep 13, 2022·0 cites·13 claims
- 1046US2014349025A1Conductive compositions and methods relating theretoDU PONT·Filed 2014·Application pending·0 cites
- 1138US2015240103A1Compositions for high speed printing of conductive materials for electronic circuitry type applications and methods relating theretoDU PONT·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →