Inventor · disambiguated record
Ming-Tung Lee
Also filed as: LEE MING · LEE MING-TUNG
14 granted patents·4 pending applications·182 citations·filing 1996–2023
91Inventor score
Top patents by PatentIndex Score
18 records- 0197US8357547B2Semiconductor bio-sensors and methods of manufacturing the sameMACRONIX INT CO LTD·Filed 2012·Granted Jan 22, 2013·55 cites·20 claims
- 0295US8227877B2Semiconductor bio-sensors and methods of manufacturing the sameLEE MING-TUNG·Filed 2010·Granted Jul 24, 2012·57 cites·7 claims
- 0381US8897470B2Method of fabricating integrated semiconductor device with MOS, NPN BJT, LDMOS, pre-amplifier and MEMS unitHUANG HSUEH-I·Filed 2009·Granted Nov 25, 2014·12 cites·7 claims
- 0469US6762662B2Hermetically sealed electrical switch assemblyFiled 2001·Granted Jul 13, 2004·16 cites·18 claims
- 0566US8581339B2Structure of NPN-BJT for improving punch through between collector and emitterCHANG CHIN-WEI·Filed 2011·Granted Nov 12, 2013·4 cites·16 claims
- 0665US9302904B2Method of fabricating integrated semiconductor device and structure thereofMACRONIX INT CO LTD·Filed 2014·Granted Apr 5, 2016·1 cites·5 claims
- 0765US8928095B2Semiconductor device having reduced leakage current at breakdown and method of fabricating thereofMACRONIX INT CO LTD·Filed 2013·Granted Jan 6, 2015·1 cites·21 claims
- 0864US6881619B1Method for fabricating a non-volatile memory and metal interconnect processMACRONIX INTERNAT CO·Filed 2004·Granted Apr 19, 2005·13 cites·22 claims
- 0959US2024237050A9Discontinuous transmission (dtx) information transmission method and apparatus thereofMEDIATEK INC·Filed 2023·Application pending·0 cites
- 1057US8354716B2Semiconductor devices and methods of manufacturing the sameMACRONIX INT CO LTD·Filed 2010·Granted Jan 15, 2013·1 cites·15 claims
- 1156US8940609B2MOS device and method of manufacturing the sameMACRONIX INT CO LTD·Filed 2014·Granted Jan 27, 2015·0 cites·11 claims
- 1254US5777536ASealed electric switch assemblyFiled 1997·Granted Jul 7, 1998·16 cites·5 claims
- 1348US8829615B2MOS device and method of manufacturing the sameCHEN CHIEN-CHUNG·Filed 2011·Granted Sep 9, 2014·0 cites·14 claims
- 1445US9202862B2Semiconductor structure and manufacturing method of the sameMACRONIX INT CO LTD·Filed 2014·Granted Dec 1, 2015·0 cites·18 claims
- 1541US2014264855A1Semiconductor composite layer structure and semiconductor packaging structure having the same thereofMACRONIX INT CO LTD·Filed 2013·Application pending·0 cites
- 1637US5849360ATube chemical gas deposition method of preparing titanium nitride coated titanium carbide for titanium carbide/silicon nitride compositesNAT SCIENCE COUNCIL·Filed 1996·Granted Dec 15, 1998·6 cites·3 claims
- 1735US2013285136A1Schottky diode with enhanced breakdown voltageLU CHIN-HSIEN·Filed 2012·Application pending·0 cites
- 1830US2012037989A1Ldmos having single-strip source contact and method for manufacturing sameHUANG HSUEH-I·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →