Inventor · disambiguated record
Hiroshi Ishino
Also filed as: ISHINO HIROSHI
18 granted patents·7 pending applications·34 citations·filing 1976–2025
90Inventor score
Top patents by PatentIndex Score
25 records- 0194US11380656B2Semiconductor deviceDENSO CORP·Filed 2020·Granted Jul 5, 2022·4 cites·14 claims
- 0292US11456238B2Semiconductor device including a semiconductor chip connected with a plurality of main terminalsDENSO CORP·Filed 2021·Granted Sep 27, 2022·3 cites·17 claims
- 0389US11996344B2Semiconductor deviceDENSO CORP·Filed 2021·Granted May 28, 2024·2 cites·7 claims
- 0488US11908778B2Semiconductor moduleDENSO CORP·Filed 2021·Granted Feb 20, 2024·2 cites·9 claims
- 0582US9351423B2Semiconductor device and semiconductor device connection structureDENSO CORP·Filed 2013·Granted May 24, 2016·7 cites·16 claims
- 0678US9520345B2Semiconductor module, semiconductor device having semiconductor module, and method of manufacturing semiconductor moduleDENSO CORP·Filed 2015·Granted Dec 13, 2016·3 cites·4 claims
- 0773US9240371B2Semiconductor module, semiconductor device having semiconductor module, and method of manufacturing semiconductor moduleISHINO HIROSHI·Filed 2012·Granted Jan 19, 2016·4 cites·11 claims
- 0866US8309434B2Method for manufacturing semiconductor device including semiconductor elements with electrode formed thereonASAI YASUTOMI·Filed 2010·Granted Nov 13, 2012·3 cites·2 claims
- 0961US2024347521A1Semiconductor deviceDENSO CORP·Filed 2024·Application pending·0 cites
- 1060US9729044B2Power conversion device having two serially-connected switching elementsDENSO CORP·Filed 2014·Granted Aug 8, 2017·3 cites·16 claims
- 1160US2024421047A1Semiconductor moduleDENSO CORP·Filed 2024·Application pending·0 cites
- 1259US12278170B2Semiconductor module, electrical component, and connection structure of the semiconductor module and the electrical componentDENSO CORP·Filed 2022·Granted Apr 15, 2025·0 cites·12 claims
- 1358US9905541B2Semiconductor module with bus bar including stacked wiring layersDENSO CORP·Filed 2015·Granted Feb 27, 2018·1 cites·10 claims
- 1457US8598458B2Electronic device and method of manufacturing the sameISHINO HIROSHI·Filed 2011·Granted Dec 3, 2013·1 cites·13 claims
- 1554US2024304560A1Semiconductor device and method of manufacturing the sameDENSO CORP·Filed 2023·Application pending·0 cites
- 1649US11817429B2Plurality of chips between two heat sinksDENSO CORP·Filed 2021·Granted Nov 14, 2023·0 cites·8 claims
- 1748US2007278550A1Semiconductor device and method for manufacturing the sameDENSO CORP·Filed 2007·Application pending·0 cites
- 1847US12438071B2Semiconductor module and method for manufacturing semiconductor moduleDENSO CORP·Filed 2023·Granted Oct 7, 2025·0 cites·6 claims
- 1947US11488895B2Semiconductor device and maunfacturing method of semiconductor deviceDENSO CORP·Filed 2021·Granted Nov 1, 2022·0 cites·11 claims
- 2047US2023378031A1Semiconductor module and method for manufacturing semiconductor moduleDENSO CORP·Filed 2023·Application pending·0 cites
- 2147US2021407875A1Semiconductor deviceDENSO CORP·Filed 2021·Application pending·0 cites
- 2246US2025246509A1Semiconductor deviceDENSO CORP·Filed 2025·Application pending·0 cites
- 2335US10535577B2Semiconductor deviceDENSO CORP·Filed 2017·Granted Jan 14, 2020·0 cites·9 claims
- 2434US10008433B2Semiconductor deviceDENSO CORP·Filed 2015·Granted Jun 26, 2018·0 cites·5 claims
- 2530US4107547ALogic circuit for a semiconductor integrated circuitOKI ELECTRIC IND CO LTD·Filed 1976·Granted Aug 15, 1978·1 cites·9 claims
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