Inventor · disambiguated record
Thomas A. Wassick
Also filed as: WASSICK THOMAS A · WASSICK THOMAS ANTHONY
56 granted patents·4 pending applications·719 citations·filing 1985–2024
98Inventor score
Top patents by PatentIndex Score
60 records- 0199US9853006B2Semiconductor device contact structure having stacked nickel, copper, and tin layersGLOBALFOUNDRIES INC·Filed 2016·Granted Dec 26, 2017·47 cites·17 claims
- 0298US9396991B2Multilayered contact structure having nickel, copper, and nickel-iron layersGLOBALFOUNDRIES INC·Filed 2014·Granted Jul 19, 2016·46 cites·15 claims
- 0394US6682872B2UV-curable compositions and method of use thereof in microelectronicsIBM·Filed 2002·Granted Jan 27, 2004·90 cites·20 claims
- 0492US4684437ASelective metal etching in metal/polymer structuresIBM·Filed 1985·Granted Aug 4, 1987·142 cites·21 claims
- 0591US9084378B2Under ball metallurgy (UBM) for improved electromigrationIBM·Filed 2013·Granted Jul 14, 2015·11 cites·16 claims
- 0691US7716992B2Sensor, method, and design structure for a low-k delamination sensorIBM·Filed 2008·Granted May 18, 2010·16 cites·19 claims
- 0788US9379007B2Electromigration-resistant lead-free solder interconnect structuresGLOBALFOUNDRIES INC·Filed 2013·Granted Jun 28, 2016·10 cites·20 claims
- 0882US9947598B1Determining crackstop strength of integrated circuit assembly at the wafer levelIBM·Filed 2017·Granted Apr 17, 2018·3 cites·20 claims
- 0981US7875502B2Semiconductor chips with crack stop regions for reducing crack propagation from chip edges/cornersIBM·Filed 2010·Granted Jan 25, 2011·5 cites·9 claims
- 1080US5843363AAblation patterning of multi-layered structuresSIEMENS AG·Filed 1995·Granted Dec 1, 1998·51 cites·14 claims
- 1177US10586782B2Lead-free solder joining of electronic structuresIBM·Filed 2017·Granted Mar 10, 2020·2 cites·25 claims
- 1277US7019402B2Silicon chip carrier with through-vias using laser assisted chemical vapor deposition of conductorIBM·Filed 2003·Granted Mar 28, 2006·23 cites·30 claims
- 1376US10833051B2Precision alignment of multi-chip high density interconnectsIBM·Filed 2019·Granted Nov 10, 2020·2 cites·20 claims
- 1476US8298929B2Offset solder vias, methods of manufacturing and design structuresDAUBENSPECK TIMOTHY H·Filed 2010·Granted Oct 30, 2012·4 cites·6 claims
- 1573US9793232B1All intermetallic compound with stand off feature and method to makeIBM·Filed 2016·Granted Oct 17, 2017·2 cites·20 claims
- 1669US6427324B1Inherently robust repair process for thin film circuitry using UV laserIBM·Filed 1998·Granted Aug 6, 2002·33 cites·10 claims
- 1768US9190376B1Organic coating to inhibit solder wetting on pillar sidewallsIBM·Filed 2014·Granted Nov 17, 2015·2 cites·14 claims
- 1868US8650512B1Elastic modulus mapping of an integrated circuit chip in a chip/device packageIBM·Filed 2012·Granted Feb 11, 2014·2 cites·23 claims
- 1968US5153408AMethod and structure for repairing electrical linesIBM·Filed 1990·Granted Oct 6, 1992·33 cites·44 claims
- 2064US11756930B2High bandwidth moduleIBM·Filed 2021·Granted Sep 12, 2023·0 cites·11 claims
- 2164US8674506B2Structures and methods to reduce maximum current density in a solder ballIBM·Filed 2013·Granted Mar 18, 2014·1 cites·13 claims
- 2264US8575007B2Selective electromigration improvement for high current C4sDAUBENSPECK TIMOTHY HARRISON·Filed 2011·Granted Nov 5, 2013·2 cites·5 claims
- 2363US9142501B2Under ball metallurgy (UBM) for improved electromigrationIBM·Filed 2014·Granted Sep 22, 2015·1 cites·23 claims
- 2463US8446006B2Structures and methods to reduce maximum current density in a solder ballBEZAMA RASCHID J·Filed 2009·Granted May 21, 2013·2 cites·22 claims
- 2562US11201136B2High bandwidth moduleIBM·Filed 2020·Granted Dec 14, 2021·0 cites·14 claims
- 2662US11043468B2Lead-free solder joining of electronic structuresIBM·Filed 2020·Granted Jun 22, 2021·0 cites·10 claims
- 2762US7294909B2Electronic package repair processIBM·Filed 2005·Granted Nov 13, 2007·2 cites·14 claims
- 2862US6444919B1Thin film wiring scheme utilizing inter-chip site surface wiringIBM·Filed 1995·Granted Sep 3, 2002·29 cites·21 claims
- 2962US2025349580A1Verifying alignment of multiple die on a substrateIBM·Filed 2024·Application pending·0 cites
- 3061US5246745ALaser-induced chemical vapor deposition of thin-film conductorsIBM·Filed 1991·Granted Sep 21, 1993·32 cites·7 claims
- 3160US8487447B2Semiconductor structure having offset passivation to reduce electromigrationINTERRANTE MARIO J·Filed 2011·Granted Jul 16, 2013·2 cites·16 claims
- 3260US7732932B2Semiconductor chips with crack stop regions for reducing crack propagation from chip edges/cornersIBM·Filed 2007·Granted Jun 8, 2010·1 cites·31 claims
- 3360US5766497AAblation pattering of multilayered structuresSIEMENS AG·Filed 1997·Granted Jun 16, 1998·20 cites·3 claims
- 3458US2025098062A1Tamper-detect assemblies including heat sink covers with integrated tamper-detect circuitryIBM·Filed 2023·Application pending·0 cites
- 3557US9515035B2Three-dimensional integrated circuit integrationIBM·Filed 2014·Granted Dec 6, 2016·0 cites·12 claims
- 3656US11882645B2Multi chip hardware security moduleIBM·Filed 2021·Granted Jan 23, 2024·0 cites·18 claims
- 3756US5543584AStructure for repairing electrical linesIBM·Filed 1992·Granted Aug 6, 1996·21 cites·24 claims
- 3856US2024213217A1Clustering fine pitch micro-bumps for packaging and testIBM·Filed 2022·Application pending·0 cites
- 3953US10249548B2Test cell for laminate and methodIBM·Filed 2017·Granted Apr 2, 2019·0 cites·20 claims
- 4053US9773726B2Three-dimensional integrated circuit integrationIBM·Filed 2016·Granted Sep 26, 2017·0 cites·14 claims
- 4151US6541709B1Inherently robust repair process for thin film circuitry using uv laserIBM·Filed 1996·Granted Apr 1, 2003·15 cites·5 claims
- 4251US6235544B1Seed metal delete process for thin film repair solutions using direct UV laserIBM·Filed 1999·Granted May 22, 2001·19 cites·9 claims
- 4350US11121101B2Flip chip packaging reworkIBM·Filed 2020·Granted Sep 14, 2021·0 cites·20 claims
- 4450US10833025B2Compressive zone to reduce dicing defectsIBM·Filed 2019·Granted Nov 10, 2020·0 cites·11 claims
- 4549US10381276B2Test cell for laminate and methodIBM·Filed 2015·Granted Aug 13, 2019·0 cites·11 claims
- 4648US10636750B1Step pyramid shaped structure to reduce dicing defectsIBM·Filed 2018·Granted Apr 28, 2020·0 cites·18 claims
- 4747US10985129B2Mitigating cracking within integrated circuit (IC) device carrierIBM·Filed 2019·Granted Apr 20, 2021·0 cites·20 claims
- 4847US9477568B2Managing interconnect electromigration effectsIBM·Filed 2013·Granted Oct 25, 2016·0 cites·18 claims
- 4947US6823585B2Method of selective plating on a substrateIBM·Filed 2003·Granted Nov 30, 2004·2 cites·13 claims
- 5047US6455331B2Process of top-surface-metallurgy plate-up bonding and rewiring for multilayer devicesIBM·Filed 2001·Granted Sep 24, 2002·3 cites·3 claims
Showing the top 50 of 60 patent records by PatentIndex Score.
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