Inventor · disambiguated record
Nan-Chin Chuang
Also filed as: CHUANG NAN-CHIN
18 granted patents·45 citations·filing 2017–2023
91Inventor score
Top patents by PatentIndex Score
18 records- 0197US11335655B2Package structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted May 17, 2022·4 cites·20 claims
- 0297US10186492B1Package structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jan 22, 2019·16 cites·20 claims
- 0393US10483617B2Package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Nov 19, 2019·7 cites·20 claims
- 0493US10312112B2Integrated fan-out package having multi-band antenna and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jun 4, 2019·8 cites·20 claims
- 0587US10475757B2Package structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Nov 12, 2019·3 cites·20 claims
- 0686US10510693B2Semiconductor package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 17, 2019·4 cites·20 claims
- 0781US12009575B2Package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jun 11, 2024·0 cites·20 claims
- 0880US11004810B2Semiconductor package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted May 11, 2021·2 cites·20 claims
- 0973US11658392B2Package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted May 23, 2023·0 cites·20 claims
- 1073US11145595B2Integrated fan-out package with antenna components and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Oct 12, 2021·1 cites·20 claims
- 1164US11043731B2Package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jun 22, 2021·0 cites·20 claims
- 1264US10867940B2Package structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 15, 2020·0 cites·20 claims
- 1359US10622222B2Integrated fan-out package having multi-band antenna and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Apr 14, 2020·0 cites·20 claims
- 1457US11553585B2Circuit board and electronic apparatus using the sameREALTEK SEMICONDUCTOR CORP·Filed 2021·Granted Jan 10, 2023·0 cites·20 claims
- 1553US10553533B2Integrated fan-out package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Feb 4, 2020·0 cites·20 claims
- 1650US12046543B2Package substrate and chip package structure using the sameREALTEK SEMICONDUCTOR CORP·Filed 2022·Granted Jul 23, 2024·0 cites·14 claims
- 1749US11227854B2Semiconductor packageREALTEK SEMICONDUCTOR CORP·Filed 2020·Granted Jan 18, 2022·0 cites·10 claims
- 1838US10998016B2Memory device including noise-suppressing mechanismREALTEK SEMICONDUCTOR CORP·Filed 2019·Granted May 4, 2021·0 cites·9 claims
Join the waitlist — get patent alerts
Get an alert when Nan-Chin Chuang files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →