Inventor · disambiguated record
Christopher M. Pelto
Also filed as: PELTO CHRISTOPHER · PELTO CHRISTOPHER M · PELTO CHRISTOPHER MICHAEL
26 granted patents·18 pending applications·132 citations·filing 2006–2024
94Inventor score
Files withINTEL CORP24HALLIBURTON ENERGY SERVICES INC12LEE KEVIN J2SHARMA ABHISHEK ANIL2BASKARAN RAJASHREE1
Top patents by PatentIndex Score
44 records- 0198US10961804B1Washout prevention element for expandable metal sealing elementsHALLIBURTON ENERGY SERVICES INC·Filed 2019·Granted Mar 30, 2021·42 cites·20 claims
- 0297US11222863B2Techniques for die stacking and associated configurationsINTEL CORP·Filed 2016·Granted Jan 11, 2022·21 cites·16 claims
- 0392US9142510B23D interconnect structure comprising through-silicon vias combined with fine pitch backside metal redistribution lines fabricated using a dual damascene type approachLEE KEVIN J·Filed 2011·Granted Sep 22, 2015·17 cites·19 claims
- 0491US9449913B23D interconnect structure comprising fine pitch single damascene backside metal redistribution lines combined with through-silicon viasLEE KEVIN J·Filed 2011·Granted Sep 20, 2016·18 cites·22 claims
- 0588US11560768B2Washout prevention element for expandable metal sealing elementsHALLIBURTON ENERGY SERVICES INC·Filed 2021·Granted Jan 24, 2023·2 cites·20 claims
- 0686US12432897B2Cooling approaches for stitched diesINTEL CORP·Filed 2021·Granted Sep 30, 2025·1 cites·22 claims
- 0786US11421505B2Wellbore packer with expandable metal elementsHALLIBURTON ENERGY SERVICES INC·Filed 2020·Granted Aug 23, 2022·2 cites·20 claims
- 0886US9196752B2Backside bulk silicon MEMSBASKARAN RAJASHREE·Filed 2011·Granted Nov 24, 2015·8 cites·25 claims
- 0984US9496173B2Thickened stress relief and power distribution layerINTEL CORP·Filed 2013·Granted Nov 15, 2016·6 cites·25 claims
- 1080US12345116B2Expandable metal as backup for elastomeric elementsHALLIBURTON ENERGY SERVICES INC·Filed 2021·Granted Jul 1, 2025·1 cites·20 claims
- 1179US11261693B2Composite expandable metal elements with reinforcementHALLIBURTON ENERGY SERVICES INC·Filed 2019·Granted Mar 1, 2022·2 cites·20 claims
- 1277US8933564B2Landing structure for through-silicon viaPELTO CHRISTOPHER M·Filed 2012·Granted Jan 13, 2015·6 cites·27 claims
- 1374US11598168B2Two part bonded seal for static downhole tool applicationsHALLIBURTON ENERGY SERVICES INC·Filed 2018·Granted Mar 7, 2023·3 cites·20 claims
- 1473US2023016540A1Method of manufacture of a variable density element retainerHALLIBURTON ENERGY SERVICES INC·Filed 2022·Application pending·0 cites
- 1570US11634964B2Swellable rubber element that also creates a cup packerHALLIBURTON ENERGY SERVICES INC·Filed 2019·Granted Apr 25, 2023·1 cites·18 claims
- 1668US2024395696A1Metal insulator metal (mim) capacitorINTEL CORP·Filed 2024·Application pending·0 cites
- 1768US2024395695A1Metal insulator metal (mim) capacitorINTEL CORP·Filed 2024·Application pending·0 cites
- 1860US11459847B2Variable density element retainer for use downholeHALLIBURTON ENERGY SERVICES INC·Filed 2019·Granted Oct 4, 2022·0 cites·15 claims
- 1958US12107040B2Metal insulator metal (MIM) capacitorINTEL CORP·Filed 2020·Granted Oct 1, 2024·0 cites·20 claims
- 2057US12436467B2Simulating die rotation to minimize area overhead of reticle stitching for stacked diesINTEL CORP·Filed 2021·Granted Oct 7, 2025·0 cites·18 claims
- 2157US11598472B2Clamp on seal for water leaksHALLIBURTON ENERGY SERVICES INC·Filed 2021·Granted Mar 7, 2023·0 cites·17 claims
- 2256US12500207B2Packaging architecture with intermediate routing layersINTEL CORP·Filed 2021·Granted Dec 16, 2025·0 cites·16 claims
- 2356US9920584B2Collet lock assembly and method for downhole load diversionHALLIBURTON ENERGY SERVICES INC·Filed 2012·Granted Mar 20, 2018·2 cites·20 claims
- 2456US2025311330A1Through-silicon via beneath memory arrayINTEL CORP·Filed 2024·Application pending·0 cites
- 2556US2025006495A1And double patterning strategy with printed erasable dummificationINTEL CORP·Filed 2023·Application pending·0 cites
- 2656US2024222272A1Double interconnects for stitched diesINTEL CORP·Filed 2022·Application pending·0 cites
- 2755US12438102B2Hermetic barrier surrounding a plurality of diesINTEL CORP·Filed 2021·Granted Oct 7, 2025·0 cites·20 claims
- 2854US2025098179A1Memory layers at opposing sides of a complementary metal-oxide semiconductor layerSHARMA ABHISHEK A·Filed 2023·Application pending·0 cites
- 2953US12469801B2Moisture seal coating of hybrid bonded stacked die package assemblyINTEL CORP·Filed 2021·Granted Nov 11, 2025·0 cites·18 claims
- 3051US12431441B2Interlayer dielectric stack optimization for wafer bow reductionINTEL CORP·Filed 2021·Granted Sep 30, 2025·0 cites·17 claims
- 3151US9850121B2Backside bulk silicon MEMSINTEL CORP·Filed 2015·Granted Dec 26, 2017·0 cites·21 claims
- 3251US2023207565A1Power delivery using backside power for stitched diesSHARMA ABHISHEK ANIL·Filed 2021·Application pending·0 cites
- 3351US2023207445A1High bandwidth and capacity approaches for stitched diesSHARMA ABHISHEK ANIL·Filed 2021·Application pending·0 cites
- 3451US2023170327A1Integrated packaging architecture with solder and non-solder interconnectsINTEL CORP·Filed 2021·Application pending·0 cites
- 3551US2015137368A1Landing structure for through-silicon viaINTEL CORP·Filed 2014·Application pending·0 cites
- 3651US2023187362A1Packaging architecture with patterned through-dielectric vias and redistribution layersINTEL CORP·Filed 2021·Application pending·0 cites
- 3751US2023207525A1Ic die stacking with mixed hybrid and solder bondingINTEL CORP·Filed 2021·Application pending·0 cites
- 3848US10229879B2Thickened stress relief and power distribution layerINTEL CORP·Filed 2016·Granted Mar 12, 2019·0 cites·18 claims
- 3948US9530740B23D interconnect structure comprising through-silicon vias combined with fine pitch backside metal redistribution lines fabricated using a dual damascene type approachINTEL CORP·Filed 2015·Granted Dec 27, 2016·0 cites·20 claims
- 4048US2024363490A1Through-silicon via dieINTEL CORP·Filed 2023·Application pending·0 cites
- 4147US2007120383A1Bumper systemMERIDIAN AUTOMOTIVE SYS INC·Filed 2006·Application pending·0 cites
- 4240US2023108000A1Topological crack stop (tcs) passivation layerINTEL CORP·Filed 2021·Application pending·0 cites
- 4338US2022034188A1Dissolvable, protective covering for downhole tool componentsHALLIBURTON ENERGY SERVICES INC·Filed 2020·Application pending·0 cites
- 4437US2021057348A1Barrier materials between bumps and padsINTEL CORP·Filed 2017·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →