Inventor · disambiguated record
Noh-Jung Kwak
Also filed as: KWAK NOH JUNG
10 granted patents·3 pending applications·84 citations·filing 1996–2019
88Inventor score
Files withSK HYNIX INC3HYNIX SEMICONDUCTOR INC2HYUNDAI ELECTRONICS IND2KIM SOO-HYUN2PARK HYUNG-SOON1
Top patents by PatentIndex Score
13 records- 0196US9425200B2Semiconductor device including air gaps and method for fabricating the sameSK HYNIX INC·Filed 2014·Granted Aug 23, 2016·42 cites·21 claims
- 0292US10411014B2Semiconductor device including air gaps and method for fabricating the sameSK HYNIX INC·Filed 2016·Granted Sep 10, 2019·7 cites·10 claims
- 0382US11296088B2Semiconductor device including air gaps and method for fabricating the sameSK HYNIX INC·Filed 2019·Granted Apr 5, 2022·2 cites·15 claims
- 0478US7541269B2Method of forming tungsten polymetal gate having low resistanceHYNIX SEMICONDUCTOR INC·Filed 2007·Granted Jun 2, 2009·8 cites·21 claims
- 0566US8252686B2Method for forming copper wiring in a semiconductor devicePARK HYUNG SOON·Filed 2009·Granted Aug 28, 2012·3 cites·48 claims
- 0665US8598012B2Method for fabricating semiconductor device with buried gatesSHIN JONG-HAN·Filed 2010·Granted Dec 3, 2013·2 cites·19 claims
- 0764US9871045B2Semiconductor device with damascene bit line and method for manufacturing the sameYEOM SEUNG-JIN·Filed 2011·Granted Jan 16, 2018·2 cites·19 claims
- 0854US8314030B2Method for fabricating semiconductor devicePARK JUM-YONG·Filed 2009·Granted Nov 20, 2012·2 cites·21 claims
- 0954US2009200672A1Method for manufacturing semiconductor deviceKIM SOO HYUN·Filed 2009·Application pending·0 cites
- 1049US2007148943A1Method for manufacturing semiconductor deviceKIM SOO HYUN·Filed 2006·Application pending·0 cites
- 1145US2009124082A1Slurry for polishing ruthenium and method for polishing using the sameHYNIX SEMICONDUCTOR INC·Filed 2008·Application pending·0 cites
- 1239US6100182AMethod for forming metal interconnection of semiconductor deviceHYUNDAI ELECTRONICS IND·Filed 1998·Granted Aug 8, 2000·9 cites·18 claims
- 1336US5940730AMethod of forming a contact hole of a semiconductor deviceHYUNDAI ELECTRONICS IND·Filed 1996·Granted Aug 17, 1999·7 cites·3 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →