Inventor · disambiguated record
Shu-Wei Kuo
Also filed as: KUO SHU-WEI
16 granted patents·4 pending applications·148 citations·filing 2010–2024
90Inventor score
Top patents by PatentIndex Score
20 records- 0196US7821699B1Electrowetting display and method for fabricating the sameIND TECH RES INST·Filed 2010·Granted Oct 26, 2010·69 cites·36 claims
- 0293US8059328B1Electrowetting display devicesKUO SHU-WEI·Filed 2010·Granted Nov 15, 2011·55 cites·19 claims
- 0381US9743513B2Flexible electronic deviceIND TECH RES INST·Filed 2014·Granted Aug 22, 2017·5 cites·15 claims
- 0480US8830558B2Electrowetting display deviceIND TECNOLOGY RES INST·Filed 2013·Granted Sep 9, 2014·9 cites·34 claims
- 0578US8587857B2Electro-wetting display device and non-polar color solution thereofKUO SHU-WEI·Filed 2010·Granted Nov 19, 2013·3 cites·16 claims
- 0675US11329500B2Charging and discharging device and charging and discharging methodIND TECH RES INST·Filed 2020·Granted May 10, 2022·1 cites·22 claims
- 0771US10522438B2Package structure having under ball release layer and manufacturing method thereofIND TECH RES INST·Filed 2017·Granted Dec 31, 2019·2 cites·11 claims
- 0871US9046681B2Electro-wetting element and operation method thereof, electro-wetting display deviceIND TECH RES INST·Filed 2013·Granted Jun 2, 2015·2 cites·18 claims
- 0965US10573587B2Package structure and manufacturing method thereofIND TECH RES INST·Filed 2017·Granted Feb 25, 2020·1 cites·9 claims
- 1064US8213072B1Electrofluidic display device and driving method thereofKU YUN-SHENG·Filed 2011·Granted Jul 3, 2012·1 cites·22 claims
- 1159US2025081347A1Electrical connection deviceIND TECH RES INST·Filed 2024·Application pending·0 cites
- 1258US2024164008A1Molded electronic assemblyIND TECH RES INST·Filed 2023·Application pending·0 cites
- 1348US11646259B2Redistribution structure and forming method thereofIND TECH RES INST·Filed 2021·Granted May 9, 2023·0 cites·15 claims
- 1448US9069250B2Electrowetting display unit and method for manufacturing thereofIND TECH RES INST·Filed 2013·Granted Jun 30, 2015·0 cites·21 claims
- 1543US10366965B2Chip bonding apparatus, chip bonding method and a chip package structureIND TECH RES INST·Filed 2017·Granted Jul 30, 2019·0 cites·18 claims
- 1641US2011007046A1Smart display devicesIND TECH RES INST·Filed 2010·Application pending·0 cites
- 1740US8717281B2Electrofluidic device and operation method thereofKU YUN-SHENG·Filed 2011·Granted May 6, 2014·0 cites·23 claims
- 1839US2012243071A1Electro-wetting display deviceLEE HSIN-HUNG·Filed 2011·Application pending·0 cites
- 1937US10249567B2Redistribution layer structure of semiconductor packageIND TECH RES INST·Filed 2017·Granted Apr 2, 2019·0 cites·20 claims
- 2036US10461035B2Semiconductor package structureIND TECH RES INST·Filed 2017·Granted Oct 29, 2019·0 cites·17 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →