Inventor · disambiguated record
Markus K. Liebhard
Also filed as: LIEBHARD MARKUS · LIEBHARD MARKUS K · LIEBHARD MARKUS KARL
11 granted patents·1 pending application·233 citations·filing 1996–2005
92Inventor score
Top patents by PatentIndex Score
12 records- 0183US6528857B1Chip size image sensor bumped packageAMKOR TECHNOLOGY INC·Filed 2000·Granted Mar 4, 2003·34 cites·24 claims
- 0283US6509560B1Chip size image sensor in wirebond package with step-up ring for electrical contactAMKOR TECHNOLOGY INC·Filed 2000·Granted Jan 21, 2003·34 cites·37 claims
- 0380US6486537B1Semiconductor package with warpage resistant substrateAMKOR TECHNOLOGY INC·Filed 2001·Granted Nov 26, 2002·30 cites·23 claims
- 0477US6589801B1Wafer-scale production of chip-scale semiconductor packages using wafer mapping techniquesAMKOR TECHNOLOGY INC·Filed 1999·Granted Jul 8, 2003·55 cites·37 claims
- 0569US6717822B1Lead-frame method and circuit module assembly including edge stiffenerAMKOR TECHNOLOGY INC·Filed 2002·Granted Apr 6, 2004·16 cites·17 claims
- 0666US6629633B1Chip size image sensor bumped package fabrication methodAMKOR TECHNOLOGY INC·Filed 2000·Granted Oct 7, 2003·13 cites·26 claims
- 0766US5764484AGround ring for a metal electronic packageOLIN CORP·Filed 1996·Granted Jun 9, 1998·33 cites·13 claims
- 0864US7176062B1Lead-frame method and assembly for interconnecting circuits within a circuit moduleAMKOR TECHNOLOGY INC·Filed 2005·Granted Feb 13, 2007·2 cites·20 claims
- 0959US6620646B1Chip size image sensor wirebond package fabrication methodAMKOR TECHNOLOGY INC·Filed 2000·Granted Sep 16, 2003·7 cites·27 claims
- 1058US6900527B1Lead-frame method and assembly for interconnecting circuits within a circuit moduleAMKOR TECHNOLOGY INC·Filed 2001·Granted May 31, 2005·6 cites·19 claims
- 1152US6509637B1Low profile mounting of thick integrated circuit packages within low-profile circuit modulesAMKOR TECHNOLOGY INC·Filed 2002·Granted Jan 21, 2003·3 cites·20 claims
- 1234US2004222927A1Surface mountable antennaFiled 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →