Inventor · disambiguated record
Yasuhiro Koshio
Also filed as: KOSHIO YASUHIRO
10 granted patents·1 pending application·183 citations·filing 1999–2016
89Inventor score
Top patents by PatentIndex Score
11 records- 0194US6392143B1Flexible package having very thin semiconductor chip, module and multi chip module (MCM) assembled by the package, and method for manufacturing the sameTOSHIBA KK·Filed 2000·Granted May 21, 2002·137 cites·30 claims
- 0286US9362196B2Semiconductor package and mobile device using the sameYAMADA KEIJU·Filed 2011·Granted Jun 7, 2016·9 cites·7 claims
- 0382US9165961B2Solid-state imaging deviceTOSHIBA KK·Filed 2014·Granted Oct 20, 2015·5 cites·20 claims
- 0477US8409919B2Method for manufacturing semiconductor deviceAOKI HIDEO·Filed 2010·Granted Apr 2, 2013·6 cites·16 claims
- 0566US9721905B2Semiconductor package and mobile device using the sameTOSHIBA KK·Filed 2016·Granted Aug 1, 2017·1 cites·8 claims
- 0661US6551854B2Semiconductor device having bump electrodes and method of manufacturing the sameTOSHIBA KK·Filed 2001·Granted Apr 22, 2003·10 cites·26 claims
- 0749US7148529B2Semiconductor packageTOSHIBA KK·Filed 2002·Granted Dec 12, 2006·5 cites·11 claims
- 0849US6960494B2Semiconductor package and method of manufacturing the sameTOSHIBA KK·Filed 2004·Granted Nov 1, 2005·4 cites·5 claims
- 0943US6836012B2Semiconductor package and method of manufacturing the sameTOSHIBA KK·Filed 2002·Granted Dec 28, 2004·2 cites·7 claims
- 1035US2012001324A1Semiconductor device and method for manufacturing the sameAOKI HIDEO·Filed 2011·Application pending·0 cites
- 1132US6198161B1Semiconductor deviceTOSHIBA KK·Filed 1999·Granted Mar 6, 2001·4 cites·6 claims
Join the waitlist — get patent alerts
Get an alert when Yasuhiro Koshio files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →