Inventor · disambiguated record
Heinz Moitzi
Also filed as: MOITZI HEINZ
13 granted patents·5 pending applications·6 citations·filing 2017–2024
84Inventor score
Top patents by PatentIndex Score
18 records- 0180US11324122B2Component carrier and method of manufacturing the sameAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2020·Granted May 3, 2022·1 cites·14 claims
- 0278US10887977B2Hybrid component carrier and method for manufacturing the sameAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2019·Granted Jan 5, 2021·2 cites·9 claims
- 0375US2025062171A1Component Carrier With Surface-Contactable Component Embedded in Laminated StackAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2024·Application pending·0 cites
- 0474US12002614B2Inductor made of component carrier material comprising electrically conductive plate structuresAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2020·Granted Jun 4, 2024·0 cites·17 claims
- 0572US10720405B2Semifinished product and component carrierAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2017·Granted Jul 21, 2020·2 cites·3 claims
- 0669US10383208B2Hybrid component carrier and method for manufacturing the sameAUSTRIA TECH & SYSTEM TECH·Filed 2018·Granted Aug 13, 2019·1 cites·19 claims
- 0765US10861636B2Inductor made of component carrier material comprising electrically conductive plate structuresAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2017·Granted Dec 8, 2020·0 cites·15 claims
- 0859US12165940B2Component carrier with surface-contactable component embedded in laminated stackAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2020·Granted Dec 10, 2024·0 cites·8 claims
- 0958US12245377B2Component carrier with embedded semiconductor component and embedded highly-conductive block which are mutually coupledAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2022·Granted Mar 4, 2025·0 cites·26 claims
- 1058US11551989B2Component carrier and method of manufacturing the sameAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2020·Granted Jan 10, 2023·0 cites·13 claims
- 1156US11380650B2Batch manufacture of component carriersAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2020·Granted Jul 5, 2022·0 cites·12 claims
- 1254US11495513B2Component carrier with embedded semiconductor component and embedded highly-conductive block which are mutually coupledAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2020·Granted Nov 8, 2022·0 cites·20 claims
- 1354US2023250520A1Composite material, process for producing a composite material and medical device based on composite materialW&M GMBH·Filed 2021·Application pending·0 cites
- 1453US11658142B2Connection arrangement, component carrier and method of forming a component carrier structureAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2020·Granted May 23, 2023·0 cites·15 claims
- 1547US2021068252A1Component Carrier and Method of Manufacturing the SameAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2020·Application pending·0 cites
- 1647US2022190464A1Component Carrier Having at Least a Part Formed as a Three-Dimensionally Printed Structure Forming an AntennaAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2022·Application pending·0 cites
- 1744US10773949B2Method of manufacturing an electronic deviceAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2017·Granted Sep 15, 2020·0 cites·11 claims
- 1840US2019110366A1Component Carrier Having at Least a Part Formed as a Three-Dimensionally Printed StructureAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2018·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →