Inventor · disambiguated record
Yuki Antoku
Also filed as: ANTOKU Yuki
10 granted patents·1 pending application·4 citations·filing 2011–2021
78Inventor score
Technology areasH10W
Top patents by PatentIndex Score
11 records- 0165US11251153B2Noble metal-coated silver wire for ball bonding, and semiconductor device using noble metal-coated silver wire for ball bondingTANAKA ELECTRONICS IND·Filed 2018·Granted Feb 15, 2022·1 cites·10 claims
- 0255US9972595B2Bonding wire for high-speed signal lineTANAKA ELECTRONICS IND·Filed 2013·Granted May 15, 2018·1 cites·9 claims
- 0355US9103001B2Ag—Au—Pd ternary alloy bonding wireCHIBA JUN·Filed 2011·Granted Aug 11, 2015·2 cites·11 claims
- 0454US12087724B2Palladium-coated copper bonding wire and method for manufacturing sameTANAKA ELECTRONICS IND·Filed 2021·Granted Sep 10, 2024·0 cites·12 claims
- 0550US11876066B2Palladium-coated copper bonding wire, wire bonding structure, semiconductor device, and manufacturing method of semiconductor deviceTANAKA ELECTRONICS IND·Filed 2021·Granted Jan 16, 2024·0 cites·13 claims
- 0649US12237293B2Palladium-coated copper bonding wire, manufacturing method of palladium-coated copper bonding wire, wire bonding structure using the same, semiconductor device and manufacturing method thereofTANAKA ELECTRONICS IND·Filed 2021·Granted Feb 25, 2025·0 cites·13 claims
- 0747US11289442B2Gold-coated silver bonding wire and manufacturing method thereof, and semiconductor device and manufacturing method thereofTANAKA ELECTRONICS IND·Filed 2020·Granted Mar 29, 2022·0 cites·6 claims
- 0844US11456271B2Noble metal-coated silver wire for ball bonding and method for producing the same, and semiconductor device using noble metal-coated silver wire for ball bonding and method for producing the sameTANAKA ELECTRONICS IND·Filed 2018·Granted Sep 27, 2022·0 cites·10 claims
- 0942US10195697B2Palladium (Pd)-coated copper wire for ball bondingTANAKA ELECTRONICS IND·Filed 2016·Granted Feb 5, 2019·0 cites·7 claims
- 1037US9362249B2Silver—gold alloy bonding wireTANAKA ELECTRONICS IND·Filed 2015·Granted Jun 7, 2016·0 cites·5 claims
- 1131US2017125135A1Noble metal-coated copper wire for ball bondingTANAKA ELECTRONICS IND·Filed 2016·Application pending·0 cites
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