Inventor · disambiguated record
Audel A. Sanchez
Also filed as: SANCHEZ AUDEL · SANCHEZ AUDEL A
28 granted patents·1 pending application·112 citations·filing 2004–2021
95Inventor score
Files withNXP USA INC12FREESCALE SEMICONDUCTOR INC10VISWANATHAN LAKSHMINARAYAN3SANCHEZ AUDEL A2JANG JIN WOOK1
Top patents by PatentIndex Score
29 records- 0197US10199302B1Molded air cavity packages and methods for the production thereofNXP USA INC·Filed 2017·Granted Feb 5, 2019·15 cites·13 claims
- 0297US10199303B1Molded air cavity packages and methods for the production thereofNXP USA INC·Filed 2017·Granted Feb 5, 2019·14 cites·18 claims
- 0392US9986646B2Packaged electronic devices with top terminations, and methods of manufacture thereofFREESCALE SEMICONDUCTOR INC·Filed 2014·Granted May 29, 2018·11 cites·10 claims
- 0491US9111984B2Devices and methods of operation for separating semiconductor die from adhesive tapeFREESCALE SEMICONDUCTOR INC·Filed 2013·Granted Aug 18, 2015·18 cites·17 claims
- 0589US8803302B2System, method and apparatus for leadless surface mounted semiconductor packageVISWANATHAN LAKSHMINARAYAN·Filed 2012·Granted Aug 12, 2014·9 cites·19 claims
- 0688US9196520B1Tape release systems and methods for semiconductor diesFREESCALE SEMICONDUCTOR INC·Filed 2014·Granted Nov 24, 2015·11 cites·18 claims
- 0787US8698291B2Packaged leadless semiconductor deviceSANCHEZ AUDEL A·Filed 2011·Granted Apr 15, 2014·10 cites·20 claims
- 0881US11343919B2Packaged electronic devices with top terminationsNXP USA INC·Filed 2019·Granted May 24, 2022·2 cites·11 claims
- 0980US10375833B2Methods of manufacturing packaged electronic devices with top terminationsNXP USA INC·Filed 2018·Granted Aug 6, 2019·2 cites·22 claims
- 1079US10241151B2Die crack detector and method thereforNXP USA INC·Filed 2017·Granted Mar 26, 2019·3 cites·20 claims
- 1176US10529638B2Molded air cavity packages and methods for the production thereofNXP USA INC·Filed 2018·Granted Jan 7, 2020·1 cites·20 claims
- 1276US10396006B2Molded air cavity packages and methods for the production thereofNXP USA INC·Filed 2018·Granted Aug 27, 2019·1 cites·20 claims
- 1376US9300254B2Radio frequency devices with surface-mountable capacitors for decoupling and methods thereofFREESCALE SEMICONDUCTOR INC·Filed 2014·Granted Mar 29, 2016·3 cites·17 claims
- 1475US9646897B2Die crack detector with integrated one-time programmable elementFREESCALE SEMICONDUCTOR INC·Filed 2013·Granted May 9, 2017·3 cites·17 claims
- 1574US10629518B2Internally-shielded microelectronic packages and methods for the fabrication thereofNXP USA INC·Filed 2018·Granted Apr 21, 2020·2 cites·20 claims
- 1673US10141227B1Method and system for achieving semiconductor-based circuits or systems having multiple components with one or more matched or similar characteristics or featuresNXP USA INC·Filed 2017·Granted Nov 27, 2018·3 cites·18 claims
- 1771US8753983B2Die bonding a semiconductor deviceJANG JIN-WOOK·Filed 2010·Granted Jun 17, 2014·3 cites·8 claims
- 1860US10861774B2Internally-shielded microelectronic packages and methods for the fabrication thereofNXP USA INC·Filed 2020·Granted Dec 8, 2020·0 cites·15 claims
- 1958US12087671B2Overmolded microelectronic packages containing knurled flanges and methods for the production thereofNXP USA INC·Filed 2021·Granted Sep 10, 2024·0 cites·15 claims
- 2056US9263375B2System, method and apparatus for leadless surface mounted semiconductor packageVISWANATHAN LAKSHMINARAYAN·Filed 2014·Granted Feb 16, 2016·0 cites·14 claims
- 2155US9105599B2Semiconductor devices that include a die bonded to a substrate with a gold interface layerFREESCALE SEMICONDUCTOR INC·Filed 2014·Granted Aug 11, 2015·0 cites·20 claims
- 2254US9111901B2Methods for bonding a die and a substrateFREESCALE SEMICONDUCTOR INC·Filed 2014·Granted Aug 18, 2015·0 cites·20 claims
- 2353US8963305B2Method and apparatus for multi-chip structure semiconductor packageFREESCALE SEMICONDUCTOR INC·Filed 2012·Granted Feb 24, 2015·0 cites·20 claims
- 2451US9800208B2Radio frequency devices with surface-mountable capacitors for decoupling and methods thereofFREESCALE SEMICONDUCTOR INC·Filed 2016·Granted Oct 24, 2017·0 cites·18 claims
- 2550US10998255B2Overmolded microelectronic packages containing knurled flanges and methods for the production thereofNXP USA INC·Filed 2018·Granted May 4, 2021·0 cites·18 claims
- 2650US9159588B2Packaged leadless semiconductor deviceSANCHEZ AUDEL A·Filed 2014·Granted Oct 13, 2015·0 cites·20 claims
- 2749US2016163623A1System, method and apparatus for leadless surface mounted semiconductor packageVISWANATHAN LAKSHMINARAYAN·Filed 2016·Application pending·0 cites
- 2844US9466588B2Method and apparatus for multi-chip structure semiconductor packageSANTOS FERNANDO A·Filed 2015·Granted Oct 11, 2016·0 cites·17 claims
- 2941US7101736B2Method of assembling a semiconductor component and apparatus thereforFREESCALE SEMICONDUCTOR INC·Filed 2004·Granted Sep 5, 2006·1 cites·12 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →