Inventor · disambiguated record
Takaomi Ikeda
Also filed as: IKEDA TAKAOMI
5 granted patents·77 citations·filing 2007–2012
80Inventor score
Technology areasB29B
Files withYOSHINAGA NAOTO5
Top patents by PatentIndex Score
5 records- 0193US8411415B2Non-thermofusible phenol resin powder, method for producing the same, thermosetting resin composition, sealing material for semiconductor, and adhesive for semiconductorYOSHINAGA NAOTO·Filed 2012·Granted Apr 2, 2013·68 cites·9 claims
- 0279US8658120B2Non-thermofusible phenol resin powder, method for producing the same, thermosetting resin composition, sealing material for semiconductor, and adhesive for semiconductorYOSHINAGA NAOTO·Filed 2012·Granted Feb 25, 2014·3 cites·3 claims
- 0374US8293860B2Non-thermofusible phenol resin powder, method for producing the same, thermosetting resin composition, sealing material for semiconductor, and adhesive for semiconductorYOSHINAGA NAOTO·Filed 2007·Granted Oct 23, 2012·3 cites·17 claims
- 0472US8158095B2Non-thermofusible phenol resin powder, method for producing the same, thermosetting resin composition, sealing material for semiconductor, and adhesive for semiconductorYOSHINAGA NAOTO·Filed 2009·Granted Apr 17, 2012·2 cites·13 claims
- 0566US8409756B2Non-thermofusible phenol resin powder, method for producing the same, thermosetting resin composition, sealing material for semiconductor, and adhesive for semiconductorYOSHINAGA NAOTO·Filed 2009·Granted Apr 2, 2013·1 cites·9 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →