Inventor · disambiguated record
Satoshi Ibaraki
Also filed as: IBARAKI SATOSHI
9 granted patents·387 citations·filing 1999–2012
89Inventor score
Top patents by PatentIndex Score
9 records- 0193US8411415B2Non-thermofusible phenol resin powder, method for producing the same, thermosetting resin composition, sealing material for semiconductor, and adhesive for semiconductorYOSHINAGA NAOTO·Filed 2012·Granted Apr 2, 2013·68 cites·9 claims
- 0291US6631073B1Electrode material and method for producing the sameKANEBO LTD·Filed 1999·Granted Oct 7, 2003·112 cites·14 claims
- 0388US6309446B1Activated carbon for adsorptive storage of gaseous compoundKANEBO LTD·Filed 1999·Granted Oct 30, 2001·187 cites·20 claims
- 0479US8658120B2Non-thermofusible phenol resin powder, method for producing the same, thermosetting resin composition, sealing material for semiconductor, and adhesive for semiconductorYOSHINAGA NAOTO·Filed 2012·Granted Feb 25, 2014·3 cites·3 claims
- 0574US8293860B2Non-thermofusible phenol resin powder, method for producing the same, thermosetting resin composition, sealing material for semiconductor, and adhesive for semiconductorYOSHINAGA NAOTO·Filed 2007·Granted Oct 23, 2012·3 cites·17 claims
- 0672US8158095B2Non-thermofusible phenol resin powder, method for producing the same, thermosetting resin composition, sealing material for semiconductor, and adhesive for semiconductorYOSHINAGA NAOTO·Filed 2009·Granted Apr 17, 2012·2 cites·13 claims
- 0766US8409756B2Non-thermofusible phenol resin powder, method for producing the same, thermosetting resin composition, sealing material for semiconductor, and adhesive for semiconductorYOSHINAGA NAOTO·Filed 2009·Granted Apr 2, 2013·1 cites·9 claims
- 0858US6940706B2Electrode material and capacitorKANEBO LTD·Filed 2000·Granted Sep 6, 2005·11 cites·13 claims
- 0950US8362187B2Phenol resin powder, method for producing the same, and phenol resin powder dispersion liquidAIR WATER INC·Filed 2007·Granted Jan 29, 2013·0 cites·11 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →