Inventor · disambiguated record
Yoshiharu Wakayama
Also filed as: WAKAYAMA YOSHIHARU
5 granted patents·74 citations·filing 2007–2012
78Inventor score
Technology areasB29B
Top patents by PatentIndex Score
5 records- 0193US8411415B2Non-thermofusible phenol resin powder, method for producing the same, thermosetting resin composition, sealing material for semiconductor, and adhesive for semiconductorYOSHINAGA NAOTO·Filed 2012·Granted Apr 2, 2013·68 cites·9 claims
- 0274US8293860B2Non-thermofusible phenol resin powder, method for producing the same, thermosetting resin composition, sealing material for semiconductor, and adhesive for semiconductorYOSHINAGA NAOTO·Filed 2007·Granted Oct 23, 2012·3 cites·17 claims
- 0372US8158095B2Non-thermofusible phenol resin powder, method for producing the same, thermosetting resin composition, sealing material for semiconductor, and adhesive for semiconductorYOSHINAGA NAOTO·Filed 2009·Granted Apr 17, 2012·2 cites·13 claims
- 0466US8409756B2Non-thermofusible phenol resin powder, method for producing the same, thermosetting resin composition, sealing material for semiconductor, and adhesive for semiconductorYOSHINAGA NAOTO·Filed 2009·Granted Apr 2, 2013·1 cites·9 claims
- 0550US8362187B2Phenol resin powder, method for producing the same, and phenol resin powder dispersion liquidAIR WATER INC·Filed 2007·Granted Jan 29, 2013·0 cites·11 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →