Inventor · disambiguated record
Ki-Chul Park
Also filed as: PARK KI-CHUL
44 granted patents·10 pending applications·410 citations·filing 2001–2025
98Inventor score
Top patents by PatentIndex Score
54 records- 0198US8684131B1Dual mufflerKIA MOTORS CORP·Filed 2013·Granted Apr 1, 2014·25 cites·6 claims
- 0294US7332764B2Metal-insulator-metal (MIM) capacitor and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Feb 19, 2008·38 cites·22 claims
- 0394US6861686B2Structure of a CMOS image sensor and method for fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Mar 1, 2005·103 cites·14 claims
- 0492US7514354B2Methods for forming damascene wiring structures having line and plug conductors formed from different materialsSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Apr 7, 2009·25 cites·21 claims
- 0591US7586175B2Semiconductor wafer having embedded electroplating current paths to provide uniform plating over wafer surfaceSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Sep 8, 2009·19 cites·14 claims
- 0688US7335590B2Method of fabricating semiconductor device by forming diffusion barrier layer selectively and semiconductor device fabricated therebySAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Feb 26, 2008·21 cites·40 claims
- 0786US10208639B2Structure of mufflerHYUNDAI MOTOR CO LTD·Filed 2016·Granted Feb 19, 2019·4 cites·11 claims
- 0886US7205666B2Interconnections having double capping layer and method for forming the sameSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Apr 17, 2007·10 cites·10 claims
- 0983US12327759B2Semiconductor device and method for fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jun 10, 2025·1 cites·16 claims
- 1083US8875836B2Tail pipe for muffler of motor vehicleHYUNDAI MOTOR CO LTD·Filed 2013·Granted Nov 4, 2014·9 cites·19 claims
- 1183US6548905B2Semiconductor device having multi-layer copper line and method of forming the sameSAMSUNG ELECTRONICS CO LTD·Filed 2002·Granted Apr 15, 2003·30 cites·6 claims
- 1280US8905188B2Muffler for motor vehicleHYUNDAI MOTOR CO LTD·Filed 2013·Granted Dec 9, 2014·4 cites·14 claims
- 1380US8528693B1Muffler with dual exhaust gas discharge pipe for vehiclePARK KI CHUL·Filed 2012·Granted Sep 10, 2013·6 cites·7 claims
- 1480US6842028B2Apparatus for testing reliability of interconnection in integrated circuitSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Jan 11, 2005·21 cites·12 claims
- 1579US10403640B2Semiconductor devices including insulating capping structuresSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Sep 3, 2019·3 cites·20 claims
- 1677US7605472B2Interconnections having double capping layer and method for forming the sameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Oct 20, 2009·5 cites·11 claims
- 1777US6884710B2Semiconductor device having multi-layer copper line and method of forming sameSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Apr 26, 2005·21 cites·10 claims
- 1875US11341529B2Wearable device and method for providing widget thereofSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted May 24, 2022·1 cites·13 claims
- 1975US8910471B2Structure of exhaust pipe for exhaust heat recoveryHYUNDAI MOTOR CO LTD·Filed 2012·Granted Dec 16, 2014·2 cites·3 claims
- 2074US6693446B2Apparatus for testing reliability of interconnection in integrated circuitSAMSUNG ELECTRONICS CO LTD·Filed 2002·Granted Feb 17, 2004·18 cites·15 claims
- 2172US7400003B2Structure of a CMOS image sensor and method for fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Jul 15, 2008·12 cites·35 claims
- 2271US7037835B2Interconnections having double capping layer and method for forming the sameSAMSUNG ELECRTONICS CO LTD·Filed 2003·Granted May 2, 2006·13 cites·17 claims
- 2370US10397760B2User terminal device and method for providing web service thereofSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Aug 27, 2019·2 cites·15 claims
- 2468US2025273512A1Semiconductor device and method for fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 2566US7365025B2Methods of forming dual-damascene interconnect structures on semiconductor substrates using multiple planarization layers having different porosity characteristicsSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Apr 29, 2008·2 cites·11 claims
- 2662US11268793B2Detonation connector having exposure part for taggingHANWHA CORP·Filed 2019·Granted Mar 8, 2022·1 cites·16 claims
- 2762US7462507B2Structure of a CMOS image sensor and method for fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Dec 9, 2008·7 cites·12 claims
- 2861US8943545B2Digital living network alliance system and method for providing content thereinLIM BYUNG-SOO·Filed 2010·Granted Jan 27, 2015·2 cites·10 claims
- 2958US7928002B2Method of forming wiring layer of semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2009·Granted Apr 19, 2011·1 cites·20 claims
- 3056US7951712B2Interconnections having double capping layer and method for forming the sameSAMSUNG ELECTRONICS CO LTD·Filed 2009·Granted May 31, 2011·0 cites·16 claims
- 3154US12354943B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jul 8, 2025·0 cites·19 claims
- 3253US11330066B2Method for receiving content from external device and electronic device thereforSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted May 10, 2022·0 cites·13 claims
- 3350US9667487B2Method and apparatus for changing input type in input system using universal plug and playSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted May 30, 2017·0 cites·9 claims
- 3450US6690187B2Apparatus for testing reliability of interconnection in integrated circuitSAMSUNG ELECTRONICS CO LTD·Filed 2002·Granted Feb 10, 2004·4 cites·6 claims
- 3549US9015383B2Method and apparatus for changing input type in input system using universal plug and playMAENG JE-YOUNG·Filed 2010·Granted Apr 21, 2015·0 cites·18 claims
- 3648US9371753B2System of controlling exhaust sound of vehicle automatically and method of the sameHYUNDAI MOTOR CO LTD·Filed 2013·Granted Jun 21, 2016·0 cites·5 claims
- 3747US2010140747A1Semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2009·Application pending·0 cites
- 3846US2023178477A1Semiconductor device and method for fabricating the semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 3946US2021356246A1Operator terminal for blasting systemHANWHA CORP·Filed 2019·Application pending·0 cites
- 4045US2010001186A1Method of measuring dimension of pattern and recording medium storing program for executing the sameHWANG SOON-SIK·Filed 2009·Application pending·0 cites
- 4144US8697568B2Semiconductor chip including a plurality of chip areas and fabricating method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2012·Granted Apr 15, 2014·0 cites·16 claims
- 4242US2018128647A1Device and method to control the uniformity of a gas flow in a cvd or an ald reactor or of a layer grown thereinAIXTRON SE·Filed 2016·Application pending·0 cites
- 4341US11054235B2Trunkline delay detonator and blast-triggering device using sameHANWHA CORP·Filed 2017·Granted Jul 6, 2021·0 cites·11 claims
- 4441US8510396B2Apparatus and method for storing content flip list of digital media server using user input feedbackLIM BYUNG-SOO·Filed 2010·Granted Aug 13, 2013·0 cites·12 claims
- 4540US2005277407A1Method and device for providing mobile services with virtual numberKT FREETEL CO LTD·Filed 2005·Application pending·0 cites
- 4639US2004217013A1Apparatus and method for electropolishing a metal wiring layer on a semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2004·Application pending·0 cites
- 4738US11361148B2Electronic device sharing content with an external device and method for sharing content thereofSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Jun 14, 2022·0 cites·14 claims
- 4837US8756303B2Method and apparatus for determining object updates in a home networkHWANG TAE-HWAN·Filed 2011·Granted Jun 17, 2014·0 cites·20 claims
- 4937US2014188985A1Method and system for executing an applicationSAMSUNG ELECTRONICS CO LTD·Filed 2013·Application pending·0 cites
- 5036US2002041028A1Method for forming damascene interconnection of semiconductor device and damascene interconnection fabricated therebyFiled 2001·Application pending·0 cites
Showing the top 50 of 54 patent records by PatentIndex Score.
Join the waitlist — get patent alerts
Get an alert when Ki-Chul Park files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →