Inventor · disambiguated record
Soon Ing Chew
Also filed as: CHEW SOON ING
9 granted patents·64 citations·filing 2008–2014
85Inventor score
Technology areasH10W
Top patents by PatentIndex Score
9 records- 0190US8907467B2PCB based RF-power package window frameKOMPOSCH ALEXANDER·Filed 2012·Granted Dec 9, 2014·20 cites·29 claims
- 0284US8013429B2Air cavity package with copper heat sink and ceramic window frameINFINEON TECHNOLOGIES AG·Filed 2009·Granted Sep 6, 2011·16 cites·15 claims
- 0382US8110915B2Open cavity leadless surface mountable package for high power RF applicationsFOWLKES DONALD·Filed 2009·Granted Feb 7, 2012·18 cites·26 claims
- 0475US9293407B2Semiconductor package having a baseplate with a die attach region and a peripheral regionINFINEON TECHNOLOGIES AG·Filed 2014·Granted Mar 22, 2016·3 cites·20 claims
- 0567US8314487B2Flange for semiconductor dieMOHAMMED ANWAR A·Filed 2009·Granted Nov 20, 2012·4 cites·18 claims
- 0657US7811862B2Thermally enhanced electronic packageINFINEON TECHNOLOGIES AG·Filed 2008·Granted Oct 12, 2010·3 cites·11 claims
- 0750US8110445B2High power ceramic on copper packageMOHAMMED ANWAR A·Filed 2009·Granted Feb 7, 2012·0 cites·18 claims
- 0849US8604609B2Flange for semiconductor dieINFINEON TECHNOLOGIES AG·Filed 2012·Granted Dec 10, 2013·0 cites·12 claims
- 0938US9209116B1Semiconductor device package having asymmetric chip mounting area and lead widthsINFINEON TECHNOLOGIES AG·Filed 2014·Granted Dec 8, 2015·0 cites·16 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →