Inventor · disambiguated record
Donald Fowlkes
Also filed as: FOWLKES DONALD · FOWLKES DONALD I
10 granted patents·25 citations·filing 2006–2023
83Inventor score
Technology areasH10W
Top patents by PatentIndex Score
10 records- 0182US8110915B2Open cavity leadless surface mountable package for high power RF applicationsFOWLKES DONALD·Filed 2009·Granted Feb 7, 2012·18 cites·26 claims
- 0267US8314487B2Flange for semiconductor dieMOHAMMED ANWAR A·Filed 2009·Granted Nov 20, 2012·4 cites·18 claims
- 0365US8258014B2Method of manufacturing a power transistor module and package with integrated bus barBLAIR CYNTHIA·Filed 2011·Granted Sep 4, 2012·2 cites·20 claims
- 0459US12392821B2Thermal and electrical conductivity between metal contacts utilizing spring pin connectorsWOLFSPEED INC·Filed 2023·Granted Aug 19, 2025·0 cites·19 claims
- 0555US7911041B2Semiconductor device with gold coatings, and process for producing itINFINEON TECHNOLOGIES AG·Filed 2006·Granted Mar 22, 2011·1 cites·26 claims
- 0652US7994630B2Power transistor package with integrated bus barINFINEON TECHNOLOGIES AG·Filed 2009·Granted Aug 9, 2011·0 cites·17 claims
- 0750US8110445B2High power ceramic on copper packageMOHAMMED ANWAR A·Filed 2009·Granted Feb 7, 2012·0 cites·18 claims
- 0849US8604609B2Flange for semiconductor dieINFINEON TECHNOLOGIES AG·Filed 2012·Granted Dec 10, 2013·0 cites·12 claims
- 0942US9269594B2High power ceramic on copper packageMOHAMMED ANWAR·Filed 2012·Granted Feb 23, 2016·0 cites·20 claims
- 1041US7961470B2Power amplifierINFINEON TECHNOLOGIES AG·Filed 2006·Granted Jun 14, 2011·0 cites·15 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →