Inventor · disambiguated record
Windsor Pipes Thomas, Iii
Also filed as: THOMAS III WINDSOR PIPES · THOMAS WINDSOR P
9 granted patents·2 pending applications·28 citations·filing 2008–2021
83Inventor score
Files withCORNING INC6CLARK JEFFREY MATHEW1CORNING RES & DEV CORP1HAWTOF DANIEL WARREN1MARKHAM SHAWN RACHELLE1
Top patents by PatentIndex Score
11 records- 0192US9296614B1Substrate such as for use with carbon nanotubesCORNING INC·Filed 2015·Granted Mar 29, 2016·9 cites·30 claims
- 0288US11878422B2Integrated manufacturing automation system architectureCORNING RES & DEV CORP·Filed 2021·Granted Jan 23, 2024·7 cites·14 claims
- 0374US9227295B2Non-polished glass wafer, thinning system and method for using the non-polished glass wafer to thin a semiconductor waferMARKHAM SHAWN RACHELLE·Filed 2012·Granted Jan 5, 2016·4 cites·19 claims
- 0469US8789390B2Near net fused silica articles and method of makingTHOMAS WINDSOR P·Filed 2011·Granted Jul 29, 2014·4 cites·16 claims
- 0567US9573835B2Non-polished glass wafer, thinning system and method for using the non-polished glass wafer to thin a semiconductor waferCORNING INC·Filed 2015·Granted Feb 21, 2017·1 cites·2 claims
- 0663US9082764B2Three-dimensional integrated circuit which incorporates a glass interposer and method for fabricating the sameCORNING INC·Filed 2013·Granted Jul 14, 2015·2 cites·21 claims
- 0761US10510576B2Carrier-bonding methods and articles for semiconductor and interposer processingCORNING INC·Filed 2014·Granted Dec 17, 2019·1 cites·13 claims
- 0852US10391746B2Flexible glass laminate structures for architectural design and other applicationsCORNING INC·Filed 2015·Granted Aug 27, 2019·0 cites·20 claims
- 0952US2016176756A1Substrate including silicaCORNING INC·Filed 2016·Application pending·0 cites
- 1045US2010124709A1Image mask assembly for photolithographyHAWTOF DANIEL WARREN·Filed 2008·Application pending·0 cites
- 1143US8062812B2Image mask and image mask assemblyCLARK JEFFREY MATHEW·Filed 2009·Granted Nov 22, 2011·0 cites·16 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →