Inventor · disambiguated record
Joshua Tseng
Also filed as: TSENG JOSHUA
10 granted patents·5 pending applications·197 citations·filing 2004–2016
89Inventor score
Top patents by PatentIndex Score
15 records- 0196US8140690B2Connection forwardingLY KAND·Filed 2008·Granted Mar 20, 2012·133 cites·42 claims
- 0293US7625791B2High-k dielectric metal gate device structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG·Filed 2007·Granted Dec 1, 2009·26 cites·14 claims
- 0389US8384195B2Nanochannel device and method for manufacturing thereofIMEC·Filed 2011·Granted Feb 26, 2013·11 cites·11 claims
- 0484US7332449B2Method for forming dual damascenes with supercritical fluid treatmentsTAIWAN SEMICONDUCTOR MFG·Filed 2005·Granted Feb 19, 2008·10 cites·15 claims
- 0576US8386637B2Connection forwardingRIVERBED TECHNOLOGY INC·Filed 2012·Granted Feb 26, 2013·3 cites·30 claims
- 0668US10424517B2Method for manufacturing a dual work function semiconductor device and the semiconductor device made thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Sep 24, 2019·1 cites·20 claims
- 0765US7544606B2Method to implement stress free polishingTAIWAN SEMICONDUCTOR MFG·Filed 2005·Granted Jun 9, 2009·2 cites·19 claims
- 0863US9024299B2Method for fabricating a dual work function semiconductor device and the device made thereofLI ZILAN·Filed 2009·Granted May 5, 2015·4 cites·11 claims
- 0962US7829949B2High-K dielectric metal gate device structureTAIWAN SEMCONDUCTOR MFG CO LTD·Filed 2009·Granted Nov 9, 2010·2 cites·20 claims
- 1052US7387973B2Method for improving low-K dielectrics by supercritical fluid treatmentsTAIWAN SEMICONDUCTOR MFG·Filed 2004·Granted Jun 17, 2008·5 cites·30 claims
- 1152US2013145036A1Connection forwardingRIVERBED TECHNOLOGY INC·Filed 2013·Application pending·0 cites
- 1249US2006248194A1Connection forwardingRIVERBED TECHNOLOGY INC·Filed 2006·Application pending·0 cites
- 1344US2010219481A1Method for manufacturing a dual work function semiconductor device and the semiconductor device made thereofIMEC·Filed 2010·Application pending·0 cites
- 1438US2005158664A1Method of integrating post-etching cleaning process with deposition for semiconductor deviceFiled 2004·Application pending·0 cites
- 1534US2005186753A1FIB exposure of alignment marks in MIM technologyFiled 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →