Inventor · disambiguated record
Joey Lai
Also filed as: LAI JOEY
5 granted patents·2 pending applications·21 citations·filing 2003–2023
75Inventor score
Top patents by PatentIndex Score
7 records- 0176US8772919B2Image sensor package with trench insulator and fabrication method thereofCHIEN WEN-CHENG·Filed 2010·Granted Jul 8, 2014·5 cites·26 claims
- 0273US7064048B2Method of forming a semi-insulating regionUNITED MICROELECTRONICS CORP·Filed 2003·Granted Jun 20, 2006·13 cites·23 claims
- 0368US9190362B2Image sensor package with trench insulator and fabrication method thereofXINTEC INC·Filed 2014·Granted Nov 17, 2015·2 cites·20 claims
- 0462US7005363B2Method of forming a semi-insulating regionUNITED MICROELECTRONICS CORP·Filed 2005·Granted Feb 28, 2006·1 cites·22 claims
- 0557US2023361144A1Chip package and manufacturing method thereofXINTEC INC·Filed 2023·Application pending·0 cites
- 0649US7105426B2Method of forming a semi-insulating regionUNITED MICROELECTRONICS CORP·Filed 2005·Granted Sep 12, 2006·0 cites·29 claims
- 0740US2006180832A1Method of forming a semi-insulating regionLAI JOEY·Filed 2006·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →