Inventor · disambiguated record
Yasuhiro Asaoka
Also filed as: ASAOKA YASUHIRO
7 granted patents·6 pending applications·125 citations·filing 1998–2003
86Inventor score
Files withMITSUBISHI ELECTRIC CORP7MATSUSHITA ELECTRIC INDUSTRIAL CO LTD3EKC TECHNOLOGY K K1RENESAS TECH CORP1
Top patents by PatentIndex Score
13 records- 0188US7250391B2Cleaning composition for removing resists and method of manufacturing semiconductor deviceEKC TECHNOLOGY K K·Filed 2003·Granted Jul 31, 2007·56 cites·9 claims
- 0276US6837963B2Semiconductor device, method of producing a semiconductor device, and semiconductor substrate cleaning apparatus used for the production methodRENESAS TECH CORP·Filed 2001·Granted Jan 4, 2005·19 cites·6 claims
- 0366US6642142B2Substrate cleaning method and method for producing an electronic deviceMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2002·Granted Nov 4, 2003·11 cites·15 claims
- 0461US6586145B2Method of fabricating semiconductor device and semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2002·Granted Jul 1, 2003·8 cites·10 claims
- 0555US6431183B1Method for treating semiconductor substratesMITSUBISHI ELECTRIC CORP·Filed 1998·Granted Aug 13, 2002·21 cites·12 claims
- 0641US6368415B1Method for washing semiconductor substrate and washing apparatus thereforMITSUBISHI ELECTRIC CORP·Filed 1998·Granted Apr 9, 2002·10 cites·3 claims
- 0740US6531381B2Method and apparatus for cleaning semiconductor device and method of fabricating semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2001·Granted Mar 11, 2003·0 cites·7 claims
- 0840US2003139046A1Method and apparatus for cleaning semiconductor device and method of fabricating semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2003·Application pending·0 cites
- 0937US2004016447A1Cleaning equipment and cleaning methodMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2003·Application pending·0 cites
- 1036US2003159716A1Wafer cleaning methodMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2002·Application pending·0 cites
- 1135US2002146911A1Semiconductor device and method of manufacturing the sameMITSUBISHI ELECTRIC CORP·Filed 2001·Application pending·0 cites
- 1234US2003214017A1Method of manufacturing a semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2002·Application pending·0 cites
- 1325US2002026952A1Method of and device for cleaning silicon wafer, cleaned silicon wafer, and cleaned semiconductor elementFiled 1998·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →