Inventor · disambiguated record
Herbert R. Anderson, Jr.
Also filed as: ANDERSON HERBERT · ANDERSON JR HERBERT R
11 granted patents·554 citations·filing 1982–1993
93Inventor score
Files withIBM11
Top patents by PatentIndex Score
11 records- 0195US4504007ASolder and braze fluxes and processes for using the sameIBM·Filed 1982·Granted Mar 12, 1985·75 cites·13 claims
- 0289US5276964AMethod of manufacturing a high density connector systemIBM·Filed 1993·Granted Jan 11, 1994·70 cites·5 claims
- 0387US5094769ACompliant thermally conductive compoundIBM·Filed 1988·Granted Mar 10, 1992·76 cites·45 claims
- 0487US4519872AUse of depolymerizable polymers in the fabrication of lift-off structure for multilevel metal processesIBM·Filed 1984·Granted May 28, 1985·64 cites·24 claims
- 0585US4885038AMethod of making multilayered ceramic structures having an internal distribution of copper-based conductorsIBM·Filed 1986·Granted Dec 5, 1989·72 cites·10 claims
- 0681US4772346AMethod of bonding inorganic particulate materialIBM·Filed 1987·Granted Sep 20, 1988·65 cites·18 claims
- 0777US4539222AProcess for forming metal patterns wherein metal is deposited on a thermally depolymerizable polymer and selectively removedIBM·Filed 1983·Granted Sep 3, 1985·45 cites·27 claims
- 0872US5213704AProcess for making a compliant thermally conductive compoundIBM·Filed 1991·Granted May 25, 1993·26 cites·6 claims
- 0962US4456675ADry process for forming metal patterns wherein metal is deposited on a depolymerizable polymer and selectively removedIBM·Filed 1983·Granted Jun 26, 1984·17 cites·6 claims
- 1059US5401911AVia and pad structure for thermoplastic substrates and method and apparatus for forming the sameIBM·Filed 1992·Granted Mar 28, 1995·30 cites·95 claims
- 1151US5205738AHigh density connector systemIBM·Filed 1992·Granted Apr 27, 1993·14 cites·14 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →