Inventor · disambiguated record
Dieter Hagmann
Also filed as: HAGMANN DIETER
4 granted patents·166 citations·filing 1988–1991
79Inventor score
Technology areasH10P
Top patents by PatentIndex Score
4 records- 0183US4869781AMethod for fabricating a semiconductor integrated circuit structure having a submicrometer length device elementIBM·Filed 1988·Granted Sep 26, 1989·74 cites·27 claims
- 0278US5268311AMethod for forming a thin dielectric layer on a substrateIBM·Filed 1991·Granted Dec 7, 1993·79 cites·3 claims
- 0338US5051377AMethod for forming a thin dielectric layer on a substrateIBM·Filed 1989·Granted Sep 24, 1991·10 cites·3 claims
- 0421US5139869AThin dielectric layer on a substrateEUEN WOLFGANG·Filed 1991·Granted Aug 18, 1992·3 cites·5 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →