Inventor · disambiguated record
Naoyuki Shinonaga
Also filed as: SHINONAGA NAOYUKI
7 granted patents·4 pending applications·63 citations·filing 1994–2006
83Inventor score
Top patents by PatentIndex Score
11 records- 0188US7642633B2Semiconductor device including capsule type semiconductor package and semiconductor chip in stacking mannerRENESAS TECH CORP·Filed 2006·Granted Jan 5, 2010·22 cites·9 claims
- 0263US6724213B2Test board for testing semiconductor deviceRENESAS TECH CORP·Filed 2002·Granted Apr 20, 2004·12 cites·5 claims
- 0359US6679716B2ConnectorRENESAS TECH CORP·Filed 2002·Granted Jan 20, 2004·11 cites·12 claims
- 0450US7166490B2Semiconductor device with terminals, and method of manufacturing the sameRENESAS TECH CORP·Filed 2003·Granted Jan 23, 2007·4 cites·3 claims
- 0546US7348191B2Semiconductor device with terminals, and method of manufacturing the sameRENESAS TECH CORP·Filed 2006·Granted Mar 25, 2008·0 cites·1 claims
- 0646US2005176173A1Chip-on-board module, and method of manufacturing the sameRENESAS TECH CORP·Filed 2005·Application pending·0 cites
- 0744US6836004B2Lead frame, and method for manufacturing semiconductor device and method for inspecting electrical properties of small device using the lead frameRENESAS TECH CORP·Filed 2003·Granted Dec 28, 2004·2 cites·1 claims
- 0839US2003020155A1Chip-on-board module, and method of manufacturing the sameMITSUBISHI ELECTRIC CORP·Filed 2002·Application pending·0 cites
- 0938US5537331AMethod of testing devices to be measured and testing system thereforMITSUBISHI ELECTRIC CORP·Filed 1994·Granted Jul 16, 1996·12 cites·5 claims
- 1038US2009174051A1Semiconductor package and semiconductor deviceOSAKA SHUICHI·Filed 2005·Application pending·0 cites
- 1133US2002025608A1Memory module, method of manufacturing the memory module, and test connector using the memory moduleMITSUBISHI ELECTRIC CORP·Filed 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →