Inventor · disambiguated record
Joel A. Gerber
Also filed as: GERBER JOEL A · GERBER JOEL ARTHUR
10 granted patents·1 pending application·839 citations·filing 1983–2007
93Inventor score
Top patents by PatentIndex Score
11 records- 0197US6260264B1Methods for making z-axis electrical connections3M INNOVATIVE PROPERTIES CO·Filed 1997·Granted Jul 17, 2001·203 cites·11 claims
- 0296US7170185B1Solvent assisted burnishing of pre-underfilled solder bumped wafers for flipchip bonding3M INNOVATIVE PROPERTIES CO·Filed 2000·Granted Jan 30, 2007·122 cites·4 claims
- 0393US5401913AElectrical interconnections between adjacent circuit board layers of a multi-layer circuit boardMINNESOTA MINING & MFG·Filed 1993·Granted Mar 28, 1995·113 cites·9 claims
- 0491US6063647AMethod for making circuit elements for a z-axis interconnect3M INNOVATIVE PROPERTIES CO·Filed 1997·Granted May 16, 2000·79 cites·20 claims
- 0589US5685939AProcess for making a Z-axis adhesive and establishing electrical interconnection therewithMINNESOTA MINING & MFG·Filed 1995·Granted Nov 11, 1997·111 cites·30 claims
- 0684US6791036B1Circuit elements using z-axis interconnect3M INNOVATIVE PROPERTIES CO·Filed 2000·Granted Sep 14, 2004·29 cites·5 claims
- 0784US6246010B1High density electronic package3M INNOVATIVE PROPERTIES CO·Filed 1998·Granted Jun 12, 2001·81 cites·7 claims
- 0883US5601678AMethod for providing electrical interconnections between adjacent circuit board layers of a multi-layer circuit boardMINNESOTA MINING & MFG·Filed 1995·Granted Feb 11, 1997·50 cites·13 claims
- 0972US5873161AMethod of making a Z axis interconnect circuitMINNESOTA MINING & MFG·Filed 1996·Granted Feb 23, 1999·46 cites·15 claims
- 1044US4700253ASlanted pole head for magnetic recordingMINNESOTA MINING & MFG·Filed 1983·Granted Oct 13, 1987·5 cites·4 claims
- 1142US2007102827A1Solvent Assisted Burnishing of Pre-Underfilled Solder-Bumped Wafers for Flipchip Bonding3M INNOVATIVE PROPERTIES CO·Filed 2007·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →