Inventor · disambiguated record
Yun-Hsin Yeh
Also filed as: YEH YUN-HSIN
4 granted patents·2 pending applications·9 citations·filing 2015–2019
64Inventor score
Files withPOWERTECH TECHNOLOGY INC6
Top patents by PatentIndex Score
6 records- 0187US9825005B2Semiconductor package with Pillar-Top-Interconnection (PTI) configuration and its MIS fabricating methodPOWERTECH TECHNOLOGY INC·Filed 2015·Granted Nov 21, 2017·7 cites·6 claims
- 0268US10862202B1Integrated antenna package structure and manufacturing method thereofPOWERTECH TECHNOLOGY INC·Filed 2019·Granted Dec 8, 2020·1 cites·20 claims
- 0361US10249585B2Stackable semiconductor package and manufacturing method thereofPOWERTECH TECHNOLOGY INC·Filed 2016·Granted Apr 2, 2019·1 cites·19 claims
- 0452US10944165B2Integrated antenna package structure and manufacturing method thereofPOWERTECH TECHNOLOGY INC·Filed 2019·Granted Mar 9, 2021·0 cites·20 claims
- 0533US2017117263A1Molded interconnecting substrate and the method for manufacturing the samePOWERTECH TECHNOLOGY INC·Filed 2016·Application pending·0 cites
- 0627US2019096866A1Semiconductor package and manufacturing method thereofPOWERTECH TECHNOLOGY INC·Filed 2017·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →